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Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package

A technology of crystal unit and mask, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc.

Inactive Publication Date: 2012-05-02
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the patterning process is used to apply the adhesive, it is impossible to bond the oscillator plate 114 to the substrate 112a or to the substrate 112a and the substrate in such a manner that the oscillation frequency of the oscillator 100 is not affected by the bonding. 112b

Method used

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  • Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package
  • Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package
  • Method of fabricating crystal unit, crystal unit fabrication mask, and crystal unit package

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Embodiment Construction

[0030] Preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0031] A description will now be given of each embodiment of a method of manufacturing a crystal unit, a crystal unit manufacturing mask, and a crystal unit package according to the present invention.

[0032] A crystal unit is also sometimes referred to as a quartz crystal unit, crystal resonator, vibrating crystal, or simply crystal.

[0033] 【Crystal unit manufacturing mask】

[0034] Figure 4A-Figure 4C A view showing an example of a crystal unit fabrication mask in one embodiment of the present invention. Figure 4A A perspective view showing a crystal unit manufacturing mask (hereinafter simply referred to as "mask") 10, Figure 4B A cross-sectional view of the mask 10 is shown in the vicinity of the perforations in the mask 10, Figure 4C A bottom view of the heater provided on the mask 10 is shown.

[0035] The mask 10 is used when bonding the osc...

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PUM

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Abstract

A method of fabricating a crystal unit fills an adhesive from a first opening in a front surface of a mask of each of penetration holes in the mask in a state in which the mask is set on a base, into each penetration hole, and heats, by a heating element, a sidewall region defining a second opening in a back surface of the mask, in order to cure a sidewall part of the adhesive in the sidewall region defining each penetration hole in contact with the adhesive filling each penetration hole. A crystal blank is bonded on the base using the adhesive in order to form the crystal unit, after removing the mask from the base.

Description

technical field [0001] The present invention relates to a method of manufacturing a crystal unit, a crystal unit manufacturing mask used when manufacturing the crystal unit, and a crystal unit package accommodating the crystal unit. Background technique [0002] Currently, conductive adhesives (or adhesives) are used to mount a crystal oscillator board of a crystal oscillator on a ceramic package of the crystal oscillator. A dispenser is used to apply the conductive adhesive to the substrate within the ceramic package. [0003] Figure 1A and Figure 1B is a view showing an example of the structure of an oscillator in the related art. [0004] Such as Figure 1A As shown in the side view, oscillator 100 includes ceramic package 112 , oscillator board 114 and circuitry 116 . Circuitry 116 includes oscillator circuitry, control circuitry, output buffer circuitry, and the like. Oscillator board 114 and circuitry 116 are disposed within ceramic package 112 . [0005] Such a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/013H03H9/10H01L21/52H01L23/08H03H3/02H03H9/02
CPCH01L24/743H03H9/0509H03H9/1021H01L2224/743Y10T29/42Y10T156/10H01L2924/00B29C65/526H03H3/007
Inventor 久保田元伊东雅之岸正一
Owner FUJITSU LTD