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Substrate processing apparatus and method of disassembling and assembling said substrate processing apparatus

A substrate processing and equipment technology, applied in the field of disassembling and assembling the substrate processing equipment, can solve the problems of reducing the operating efficiency of the substrate processing equipment 10 and spending a lot of time

Active Publication Date: 2016-03-23
JUSUNG ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, in order to remove the electrostatic chuck 16, it takes a lot of time to assemble and disassemble the chamber 12, thereby reducing the operating efficiency of the substrate processing apparatus 10.

Method used

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  • Substrate processing apparatus and method of disassembling and assembling said substrate processing apparatus
  • Substrate processing apparatus and method of disassembling and assembling said substrate processing apparatus
  • Substrate processing apparatus and method of disassembling and assembling said substrate processing apparatus

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Embodiment Construction

[0023] Reference will now be made in detail to the embodiments, which are illustrated in the drawings. Whenever possible, similar reference numerals will be used to refer to the same or similar parts.

[0024] figure 2 Is a cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention.

[0025] in figure 2 In this case, the substrate processing apparatus 110 includes a chamber 112, a substrate support 116, a gas distribution plate 118, an intake pipe 120, and a gate valve 170. The cavity 112 includes a cover 112a, a cavity 112c having an opening portion 112b on one side, and a door 112d for closing the opening portion 112b. A gate valve 170 for transferring the substrate 114 may be formed on the side wall of the cavity 112c, and the gate valve 170 may be disposed to face the opening portion 112b.

[0026] The door 112d and the substrate support 116 are connected to each other by a connecting member 124. Thereby, the substrate s...

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Abstract

A substrate processing apparatus including: a chamber including a chamber having an opening portion and a door for closing the opening portion; a substrate support connected to the door; and a door operating part including a rotation shaft, the The rotation shaft is used to linearly move the door and to rotate the door, and the door and the cavity are separated from each other in a parallel manner by moving the door along the straight line.

Description

[0001] This application claims the priority of Korean Patent Application No. 10-2010-0101357 filed on October 18, 2010, and the entire content of this application is hereby incorporated by reference. Technical field [0002] The present application relates to a substrate processing apparatus including a door, and more specifically, to a substrate processing apparatus that allows a substrate support to be removed from and into the chamber by opening and closing the door, and a split and A method of assembling the substrate processing equipment. Background technique [0003] Semiconductor devices, display devices, and solar cells are generally manufactured through a deposition process that forms a thin film on a substrate, a photolithography process that selectively exposes and shields the thin film using a photosensitive material, and an etching process that selectively removes the thin film. In the manufacturing process, plasma is used to perform deposition processing and etching ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01J37/32
CPCH01J37/32091H01L21/6831Y10T29/49815H01L21/67069
Inventor 林根荣金度衡李主日
Owner JUSUNG ENG