Substrate stitching device, stitching method and substrate groupware thereof

Abstract

The invention discloses a substrate stitching device, a stitching method and a substrate groupware thereof. The substrate stitching device mainly comprises a main body unit, a conveying unit, a top cover unit, a gluing unit, a vacuum-pumping unit and a heating unit. The conveying unit is used to convey at least one first substrate and at least one second substrate into the substrate stitching device. The top cover unit is used to adsorb the first substrate on the top cover unit. The gluing unit is used to coat adhesive glue on the second substrate. With the top cover unit moving toward the conveying unit and with the cooperation of the vacuum-pumping unit and the heating unit, the first substrate and the second substrate are applied tightly so as to form the substrate groupware. According to the invention, process time can be effectively saved and cost can be minimized.

Description

technical field [0001] The invention relates to a pressing device and a pressing method thereof, in particular to a substrate pressing device, a pressing method and a substrate group thereof. Background technique [0002] By the way, the performance and power of current electronic products are getting higher and higher, so the heat emitted is getting higher and higher, so most electronic products that require high heat dissipation efficiency will have a substrate with a heat dissipation metal layer on the electronic product Internally, for example, the power supply of a personal computer, light-emitting diodes, and even the heat dissipation inside a car all use the substrate with a heat dissipation metal layer to assist heat dissipation. In addition, the above-mentioned substrate with a heat dissipation metal layer can also be made into a printed circuit board (Print Circuit Board, PCB) with an etched circuit unit, and is widely used in the field of electronic motors (such a...

AI Technical Summary

Problems solved by technology

The known pressing device 1' has the following disadvantages: (1) the known pressing device 1', the plane of the pressing part 10' and the base 11' for the pressing operation will be worn out due to long-term use or its own structure The problem of not being flat due to poor design

The copper foil layer 12' and the metal plate 13' will also be affected by the manufacturing quality, resulting in the problem of insufficient flatness

(2) In the known lamination device 1', a solid buffer material needs to be added between the lamination device 1' and the copper foil layer 12' and the metal plate 13' to be laminated, which makes the operation procedure complicated and increases the production cost and not environmentally friendly

(3) The known pressing method is to directly use the pressing device 1' to carry out the pressing operation on the copper foil layer 12' and the metal plate 13', so only the pressing part 10', the base 11' or the copper foil layer 12 'and metal plate 13', etc., if the flatness of any component is insufficient, it will cause the problem that the temperature and pressure cannot be evenly distributed, which will seriously affect the effect of pressing

(4) The known lamination method is easily affected by insufficient flatness of the components, resulting in micro-cracks or fragments, resulting in poor yields

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