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Method for setting test points

A technology of test points and measurement points, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve problems such as increased labor costs, error-prone, increased printed circuit board production risks, etc., to save costs and time, The effect of reducing error rate and improving production efficiency

Inactive Publication Date: 2013-08-21
HUNAN ZHONGKE ELECTRIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, it is worth noting that the existing method of configuring the test points on the circuit board needs to be manually configured one by one by the layout personnel. This not only increases the labor cost, but also once the layout personnel are distracted, inattentive or distracted It is easier to make mistakes, which virtually increases the production risk of printed circuit boards, and is quite uneconomical.

Method used

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Examples

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no. 1 example

[0022] According to the first embodiment of the present invention, please refer to figure 1 , the steps therein can be performed by an automated tool (for example: an automated program). First, in step S100, the program will first read the wiring file, wherein the wiring file can be an information file when laying out the circuit substrate, for example: NET_NAME file, and the wiring file can include one or more wiring (trace ).

[0023] Since the wiring file is used to define the settings of various parameters on the circuit substrate, including: whether the wiring has an initial measurement point, the position coordinates of the initial measurement point on the circuit substrate, the name of the component connected to the initial measurement point, and the initial measurement point The test point type of the test point and so on. Therefore, in step S110, according to the method of the first embodiment of the present invention, that is, according to the read wiring file, it ...

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Abstract

The invention discloses a method for setting test points. The method is suitable for setting at least one test point on a circuit base board in a wiring file and comprises the following steps of: reading the wiring file, wherein the wiring file comprises at least one wiring; judging whether the wiring has an initial test point or not; and setting the test points on the wiring without the initial test point. The method for setting the test points has the advantages that the cost and the time for manually configuring the test points are saved, and the error rate during test point distribution is reduced, so the production benefit of the circuit base board is effectively improved.

Description

technical field [0001] The present invention relates to a method for setting test points, in particular to a method for setting test points which can configure test points through automation tools. Background technique [0002] The printed circuit board is a key component of an electronic device. Its main function is to fix the parts and connect the circuits between the parts to provide a stable circuit environment. Generally speaking, according to the way of circuit configuration, printed circuit boards can be mainly divided into three types: single-sided boards, double-sided boards and multi-layer boards. Among them, the single-sided board uses the insulating substrate as the support body when the parts are installed, and the metal lines connecting the parts are laid out on the insulating substrate. [0003] As the functions of electronic devices become increasingly diversified, the number of components increases, and the circuit design of circuit boards becomes more comp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 郑力荣
Owner HUNAN ZHONGKE ELECTRIC