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Semiconductor device and manufacturing method thereof
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A manufacturing method, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as bump short circuit, connection error, low light transmittance, etc., and achieve easy and accurate alignment position, the effect of blocking connection errors
Active Publication Date: 2016-08-24
SONY CORP
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However, since the underfill resin filled with a filler or the like has low light transmittance, it is difficult to recognize the alignment marks formed on the underside of the underfill resin.
[0006] Therefore, when semiconductor chips are mounted, it is difficult to precisely align their positions, and thus problems arise due to the occurrence of connection errors (for example, short circuits between bumps)
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no. 1 example
[0026] 2. Manufacturing method of the semiconductor device of the first embodiment
[0027] 3. Second embodiment of semiconductor device
[0028] 4. Manufacturing method of the semiconductor device of the second embodiment
[0031] A semiconductor device according to a first embodiment of the present invention will be described below. figure 1 A semiconductor device showing a first embodiment of the present invention. It will be described with reference to a cross-sectional view of a portion where the bump electrode 19 is formed on the pad electrode 12 on the semiconductor element 11. figure 1 The semiconductor device 10 is shown.
[0032] The semiconductor device 10 has a pad electrode 12 on a semiconductor element 11 . In addition, a passivation layer 13 is formed on the entire surface of the semiconductor element 11 except for the opening of the pad electrode 12 . ...
example 1
[0099] The shape of the alignment mark formed in the above-mentioned semiconductor device will be described below.
[0100] Preferably, the alignment mark should be formed in such a manner that the planar shape in which the alignment mark is formed on the element surface is different from the shape of the bump electrode. For example, if Figure 7 As shown, the bump electrode 19 is generally formed in a circular shape on the semiconductor element 11 . Therefore, the alignment mark is formed to have a shape other than a circle. Like the alignment mark 42, the alignment mark is formed to have a cross shape combining rectangles. Also, like the alignment mark 43, the alignment mark is formed in a square shape. In addition, the alignment mark is also formed to have a shape such as a star or a triangle.
[0101] As described above, by making the shape of the alignment mark different from that of the bump electrode formed in the semiconductor device, for example, even when the bum...
example 2
[0103] Additionally, for example Figure 8A As shown, the alignment mark formed in the semiconductor device may be formed to surround the outer peripheral portion of the semiconductor element.
[0104] exist Figure 8A In the shown semiconductor device, the bump electrode 19 is formed in a circular shape on the semiconductor element 11 . Then, an alignment mark 44 is formed to surround the outer peripheral portion of the semiconductor element 11 . Further, an underfill resin formed on the bump electrode 19 side of the semiconductor device is formed inside the alignment mark 44 surrounding the outer peripheral portion of the semiconductor element 11 .
[0105] The alignment mark 44 includes a rectangular alignment mark 44A formed at a corner of the semiconductor element 11 and an alignment mark 44B formed at an opposite corner of the alignment mark 44A. In addition, the alignment mark 44 also includes an alignment mark 44C continuously formed on the outer peripheral portion ...
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Abstract
The invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a semiconductor element; a pad electrode formed on the semiconductor element; an alignment mark formed on the semiconductor element; a connection electrode formed on the pad electrode; A filling resin is formed to cover the connection electrodes, wherein a height of the alignment mark from the semiconductor element is larger than a height of the connection electrodes. According to the present invention, even when the underfill resin is formed to cover the connection electrodes, it is possible to provide a semiconductor device in which an alignment mark can be easily recognized and a position can be easily and accurately aligned.
Description
[0001] Cross References to Related Applications [0002] The present invention contains subject matter related to the disclosure of Japanese Priority Patent Application JP 2010-282082 filed in the Japan Patent Office on Dec. 17, 2010, the entire content of which is hereby incorporated by reference. technical field [0003] The present invention relates to a semiconductor device formed with alignment marks for connecting flip chips, and a method of manufacturing the semiconductor device. Background technique [0004] In the prior art, in flip chip mounting in which a semiconductor chip is mounted by solder bumps, alignment marks are formed on the semiconductor chip by using metal wiring. Also, in flip chip mounting, a semiconductor chip is mounted, and an underfill resin for improving reliability is filled under the mounted semiconductor chip. In addition, in order to avoid resin contamination due to the flow of underfill resin on electrodes (for example, wiring bonding pads...
Claims
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