Plating device

Abstract

Disclosed is a plating device which makes it possible to effectively form a plated layer of uniform thickness on base particles having an electrically conductive surface. The plating device is a device for plating base particles having an electrically conductive surface, which comprises: a plating tank having a plating chamber provided with a bottom surface which can circulate while the base particles come into contact therewith and a peripheral wall surface standing upright along the peripheral edge of the bottom surface, and which can house a particle group containing the base particles and plating liquid; a plating liquid supply pipe which has a supply port that opens upwards from the bottom surface of the plating chamber, and which supplies the plating liquid from the supply port in such a way that said plating liquid swirls around the peripheral wall surface of the plating chamber; a plating liquid discharge pipe which has a discharge port that opens into the plating chamber; a negative electrode which comes into contact with the base particles disposed on the bottom surface of the plating chamber; a positive electrode which is disposed at a position immersed in the plating liquid housed in the plating chamber; and a power source which is connected to the negative electrode and positive electrode.

Description

technical field [0001] The present invention relates to an electroplating device for substrate particles having conductivity on the surface. Background technique [0002] As an example of the technique of electroplating substrate particles having electrical conductivity on the surface, there is a technique of electroplating solder on the surface of a core ball mainly composed of Cu to form a solder-coated Cu core ball (hereinafter abbreviated as Cu core ball). )Technology. Furthermore, in order to clarify the problems of the prior art, the electroplating technique is described by taking Cu core balls as an example, but the present invention is not limited to Cu core balls. [0003] In recent years, semiconductor packages such as Ball Grid Array (BGA) or Chip Scale Package (CSP) have progressed in high-density packaging through multi-pitch and narrow pitch. Among them, small-diameter Cu core balls are used as bumps for I / O terminals. Since the Cu core ball does not melt du...

AI Technical Summary

Problems solved by technology

[0010] However, according to the electroplating device of this patent document 3, since the fine powder only rides on the suspension flow of the fine powder and flows, the probability of contact with the cathode plate is not uniform among the fine powders. The reason is that it is not sufficient to form a plating layer with a uniform thickness on each substrate particle.

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