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Integrated circuit package and assembling method therefor

A technology of integrated circuits and assembly methods, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of multiple assembly steps, expensive fan-out wiring, etc.

Inactive Publication Date: 2012-11-07
BROADCOM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, conventional techniques for forming wafer-level packages are expensive due to the use of fan-out wiring and use more assembly steps

Method used

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  • Integrated circuit package and assembling method therefor
  • Integrated circuit package and assembling method therefor
  • Integrated circuit package and assembling method therefor

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Embodiment Construction

[0075] I. Introduction

[0076] This specification discloses one or more embodiments that incorporate the features of this invention. The disclosed embodiments are for illustration only. The scope of protection of the invention is not limited to the disclosed embodiments. The invention is defined by the appended claims.

[0077] References in the specification to "one embodiment," "an embodiment," "example embodiment," etc., mean that the described embodiment may include a particular feature, structure, or characteristic, but that not every embodiment must include those A specific feature, structure, or characteristic. Furthermore, such expressions are not referring to the same embodiment. Further, when specific features, structures or characteristics are described in conjunction with an embodiment, whether or not there is an explicit description, it has been indicated that it is within the knowledge of those skilled in the art to combine such features, structures or chara...

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PUM

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Abstract

The invention relates to methods, systems and apparatuses for improved integrated circuit packages. An integrated circuit package includes a semiconductor substrate and a semiconductor die. The semiconductor substrate has opposing first and second surfaces, a plurality of vias through the semiconductor substrate, and routing of one or both surfaces of the semiconductor substrate. The die is mounted to the first surface of the semiconductor substrate. An encapsulating material encapsulates the die on the first surface of the semiconductor substrate.

Description

technical field [0001] The present invention relates to integrated circuit packaging. Background technique [0002] An integrated circuit (IC) chip or die is typically connected to other circuitry using a package that can be attached to a circuit board. One such type of IC die package is the ball grid array (BGA) package. BGA packages offer a smaller footprint than many other packaging solutions available today. One type of BGA package includes one or more IC dies attached to a first surface of a package substrate and includes a series of solder ball pads on a second surface of the package substrate. The solder balls are attached to the solder ball pads. The solder balls are reflowed to attach the package to the board. [0003] One advanced type of BGA package is the wafer level BGA package. Wafer-level BGA packaging goes by several names in the industry, including wafer-level chip-scale packaging (WLCSP), among others. In wafer-level BGA packaging, solder balls are di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/56H01L23/488H01L23/31H01L25/065
CPCH01L2924/10329H01L2224/14181H01L24/29H01L24/06H01L23/147H01L2224/02379H01L24/05H01L2224/05569H01L22/20H01L24/16H01L2224/83193H01L2924/14H01L24/73H01L24/13H01L2924/01005H01L2224/92125H01L2224/2919H01L2924/01013H01L2224/06181H01L24/03H01L2224/131H01L2224/83191H01L2924/1431H01L2224/0345H01L25/50H01L2924/09701H01L24/83H01L2224/0557H01L2224/32225H01L25/0657H01L21/561H01L24/14H01L24/92H01L2223/5442H01L24/97H01L2224/97H01L2924/01047H01L2224/16225H01L2224/1403H01L2924/01006H01L21/568H01L2924/01079H01L2924/15311H01L2224/02381H01L2924/10253H01L2224/83192H01L2224/32145H01L2224/0346H01L2224/73204H01L2225/06568H01L2924/014H01L2225/06541H01L2224/0401H01L2924/01029H01L2224/16145H01L2225/06513H01L2924/157H01L24/32H01L23/481H01L23/3128H01L2924/01033H01L23/49827H01L2924/00014H01L2924/181H01L2224/81H01L2924/00012H01L2924/00H01L2224/05552
Inventor 雷泽厄·拉曼·卡恩爱德华·洛沃肯·建明·王
Owner BROADCOM CORP