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Device for taking wafers from magazines, wafer loading equipment and wafer loading system

A chip and material box technology, applied in the direction of transportation and packaging, conveyor objects, electrical components, etc., can solve the problem of reduced reliability and achieve the effect of simple chip loading procedures

Active Publication Date: 2016-04-20
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cells are thinner and lighter, and they are easily bonded to each other, it is easy for a manipulator using a common suction cup to take out multiple cells at a time, and the reliability of the device is greatly reduced.

Method used

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  • Device for taking wafers from magazines, wafer loading equipment and wafer loading system
  • Device for taking wafers from magazines, wafer loading equipment and wafer loading system
  • Device for taking wafers from magazines, wafer loading equipment and wafer loading system

Examples

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Embodiment Construction

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0032] In the description of the present invention, the orientation or positional relationship indicated by the terms "inside", "outside", "longitudinal", "transverse", "upper", "lower", "top", "bottom" etc. are based on the drawings The orientations or positional relationships shown are only for the convenience of describing the invention and do not require the invention to be constructed and operated in a specific orientation, and thus should not be construed as limitations on the invention.

[0033] The wafer loading system, wafer loa...

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PUM

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Abstract

The invention discloses a device for taking a wafer from a magazine. The device comprises a grabbing component, a wafer propping component and a wafer blowing component, wherein the grabbing component is used for grabbing a wafer from the magazine; the wafer propping component is connected with the grabbing component and used for propping the wafer grabbed by the grabbing component when the grabbing component grabs the wafer; and the wafer blowing component is arranged around the grabbing component and used for blowing air to the wafer grabbed by the grabbing component. Through the wafer taking device disclosed by the invention, the problem existing in the process of grabbing multiple wafers in one step can be solved well. The invention also discloses wafer loading equipment and a wafer loading system. The wafer loading equipment and the wafer loading system have the advantages of high wafer taking efficiency and simple structure.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an improved device for taking wafers from magazines, wafer feeding equipment and a wafer feeding system provided therewith. Background technique [0002] For example, in the production line of solar cells, the following two types of magazines are usually used: basket-type magazines and laminated magazines. In the basket-type magazine, each cell is set in the corresponding slot of the magazine, while all the batteries in the laminated magazine are stacked together, as shown in Figure 1, where schematically A conventional laminated cartridge 100' is shown. [0003] In the existing automatic feeding equipment, it is necessary to use a manipulator to take out the cells in the laminated magazine 100' one by one for subsequent processing. However, since the battery sheets are thin and light, and are easily bonded to each other, it is easy for a manipulator using a common sucti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/683H01L21/677
Inventor 杨斌
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD