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Formed microchannel heat exchanger

A technology of heat exchanger and heat exchange layer, applied in heat exchange equipment, indirect heat exchanger, heat exchanger conduit, etc., can solve problems such as increasing the cost of microchannel heat exchanger

Active Publication Date: 2012-12-05
INGERSOLL RAND IND U S INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The number of tubes required and the possibility of failing brazed joints add to the cost of the microchannel heat exchanger

Method used

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  • Formed microchannel heat exchanger
  • Formed microchannel heat exchanger
  • Formed microchannel heat exchanger

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the structures and arrangements of parts set forth in the following description or shown in the following drawings details. The invention is capable of other embodiments and of being practiced or carried out in various ways.

[0019] figure 1 A gas compression system 10 comprising a compressor 15 , a prime mover 20 and a dryer 25 is schematically shown. Compression system 10 includes refrigeration system 30 and may optionally include a second fluid system. Refrigeration system 30 includes a refrigeration compressor 40 , a condenser 45 , and an expansion device 50 as is typical with refrigeration system 30 . The second fluid system, if included, includes a pump and a reservoir for the second fluid, which can be used as a heat sink to reduce peak loads on the refrigeration system 30 .

[0020] Prime mover 20 may include an ele...

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PUM

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Abstract

A heat exchanger (80) includes a plurality of heat exchange layers (95) stacked in a stackwise direction. Each of the layers includes a first plate (110) and a second plate (115), each of the first plate and the second plate includes a portion of a first enclosed header (120), a second enclosed header (125) and at least one flow channel (130) that extends between the first enclosed header and the second enclosed header. The first plate and the second plate are fixedly attached to one another to completely define the first enclosed header, the second enclosed header, and the at least one flow channel. An inlet header (85) is in fluid communication with the first enclosed header of each of the plurality of heat exchange layers (95) to direct a flow of fluid to the heat exchange layers.,An outlet header is in fluid communication with the second enclosed header of each of the plurality of heat exchange layers to direct the flow of fluid from the heat exchange layers. The heat exchanger also includes a plurality of fins (100) with each positioned between adjacent heat exchange layers.

Description

technical field [0001] The present invention relates to heat exchangers, and more particularly to microchannel heat exchangers assembled using profiled plates. Background technique [0002] A microchannel heat exchanger includes a plurality of small channels through which a first fluid flows. The large surface area to volume ratio increases heat transfer efficiency, allowing the use of smaller heat exchangers. [0003] However, microchannel heat exchangers typically include channels formed from extruded tubes that are brazed into the heat exchanger assembly. The number of tubes required and the possibility of failing brazed joints add to the cost of the microchannel heat exchanger. Contents of the invention [0004] In one embodiment, the present invention provides a heat exchanger comprising a plurality of heat exchange layers stacked in a stacking direction. Each of the layers includes a first plate and a second plate, each of the first plate and the second plate incl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D9/00F28D1/03F28F3/02F28F9/02
CPCF28F3/025F28F2260/02F28F2210/00F28F9/0273F28F9/0263F28F2210/02F28D1/0316F28D2021/0038F28D9/0031
Inventor C.J.伯格
Owner INGERSOLL RAND IND U S INC