Mobile communication device
A technology of mobile communication equipment and conductive bumps, which is applied in the direction of telephone structure, connecting contact material, etc., to achieve the effect of grounding
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2013-01-09
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to the field of communication equipment, in particular to a mobile communication equipment. Background technique
[0002] At present, metal casings are widely used in various mobile communication devices, and the grounding of metal casings is a key issue considered by designers of mobile communication devices. figure 1 It is a schematic diagram of the distribution of the grounding points of the metal shell of the prior art mobile communication equipment, figure 2 It is a schematic diagram of the distribution of the circuit board grounding points of the prior art mobile communication equipment. Such as figure 1 and figure 2 As shown, in the prior art, a conductive material 11 (for example, conductive cloth or conductive cotton) is pasted on the metal shell 10, and a metal contact area 21 (for example, copper leakage or shielding cover), when the metal shell 10 is fixed to the circuit board 20 , the conductive material 11 is e...
Examples
Embodiment Construction
[0023] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.
[0024] refer to image 3 , image 3 It is a structural schematic diagram of the mobile communication device according to the first embodiment of the present invention. Such as image 3 As shown, in this embodiment, the mobile communication device includes: a conductive casing 31 , a plastic casing 32 and a circuit board 33 .
[0025] Wherein, the conductive shell 31 includes a conductive protrusion 311 . In this embodiment, the conductive protrusion 311 is preferably integrally formed with the conductive housing 31. In other embodiments, the conductive protrusion 311 may also be welded on the conductive housing 31 or fixed on the conductive housing 31 by other means. superior.
[0026] It should be noted that, in this embodiment, the conductive shell 31 is preferably a metal shell, and in other embodiments, the conductive shell 31 can also be a p...