Anti-gluing method for flexible board in groove region of rigid-flexible board

Abstract

The invention relates to an anti-gluing method for a flexible board in a groove region of a rigid-flexible board, comprising the following steps of: firstly, arranging an adhesive tape above a flexible board region which is adjacent to a rigid board region of the rigid-flexible board and is provided with a groove between the rigid board region and the flexible board region; secondly, laminating the rigid-flexible board; and thirdly, removing the adhesive tape. According to the anti-gluing method for the flexible board in the groove region of the rigid-flexible board provided by the invention, the adhesive tape is directly pasted on the flexible board region as a protection layer, the protection layer is removed after the rigid-flexible board is laminated, and excessive glue also can be removed with the protection layer even the excessive glue overflows in a laminating process of the rigid-flexible board, so that the protection layer can ensure that no residual excessive glue of prepreg is left on a cover film used for protecting the flexible board in the groove region, and further the complete appearance of the cover film is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, and more specifically, the invention relates to a method for preventing sticking of a flexible board in a groove area of ​​a rigid-flex board. Background technique [0002] There is generally a layer of CVL (Coverlayer, covering film) on the soft board area of ​​the soft-hard board to protect the soft board area like a solder mask. This layer of film requires good adhesion to the soft board area without damage. The soft board area and the hard board area are far apart in the design of the soft-rigid board, but some soft board areas and the hard board area are too close to form a groove area when the soft-hard board is designed. When this kind of flexible and rigid board with groove design is blindly milled and uncovered on the soft board area, the overflowing excess glue will easily pull the covering film, causing damage to the PI (Polyimide) film on it, affecting Appearance, severe ex...

AI Technical Summary

Problems solved by technology

[0007] However, in technology (1), since the amount of glue spilled from the prepreg will fluctuate within a certain range (generally 0.2-1.5mm), it is difficult to accurately define the proper shrinkage of the prepreg, and when the groove size is too small, it is easy to overflow the glue from the prepreg to soft board area

However, in technology (2), the padding on the soft board area has a large application limitation and is inconvenient to operate, so it can only be used in some stacked structures.

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