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PCB (Printed Circuit Board)

A technology of PCB board and aluminum board, applied in the field of PCB board with heat dissipation structure, can solve the problems of good vertical thermal conductivity and poor horizontal thermal conductivity.

Inactive Publication Date: 2013-03-06
陈伟杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] After adopting the above structure, the present invention has the following advantages: after adopting the carbon layer, the transverse thermal conductivity of carbon is very good, and the longitudinal thermal conductivity is also good, which can well solve the problem of poor transverse thermal conductivity of various structures in the prior art

Method used

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  • PCB (Printed Circuit Board)
  • PCB (Printed Circuit Board)
  • PCB (Printed Circuit Board)

Examples

Experimental program
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specific Embodiment 1

[0027] combined with Figure 4 , a kind of PCB board, it comprises conductive layer 1, insulation layer 2 and heat dissipation layer, described three layers are fixed in order from top to bottom, and described heat dissipation layer is carbon layer 6, and described carbon layer 6 It is a plate-shaped structure made of carbon material.

specific Embodiment 2

[0028] combined with Figure 6 , a kind of PCB board, it comprises conductive layer 1, insulation layer 2 and heat dissipation layer, described three layers are fixed in order from top to bottom, and described heat dissipation layer is carbon layer 6, and described carbon layer 6 It is a plate-shaped structure made of carbon material. A layer of aluminum plate 3 is arranged between the carbon layer 6 and the insulating layer 2 .

specific Embodiment 3

[0029] combined with Figure 7 , a kind of PCB board, it comprises conductive layer 1, insulation layer 2 and heat dissipation layer, described three layers are fixed in order from top to bottom, and described heat dissipation layer is carbon layer 6, and described carbon layer 6 It is a plate-shaped structure made of carbon material. A layer of aluminum plate 3 is arranged between the carbon layer 6 and the insulating layer 2 . The aluminum plate 3 is provided with a hollow part 7, and the carbon layer 6 is filled in the hollow part 7. The hollow portion 7 can be provided in multiples during specific implementation.

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Abstract

The invention relates to a PCB (Printed Circuit Board), comprising a conduction layer (1), an insulation layer (2) and a heat radiation layer, wherein the three layers are sequentially fixed from top to bottom. The PCB is characterized in the heat radiation layer is a carbon layer (6) which is in a plate-shaped structure formed by pressing a carbon material. The PCB provided by the invention has a better heat radiation property and is convenient to install.

Description

technical field [0001] The invention relates to the technical field of PCB board heat dissipation, in particular to a PCB board with a heat dissipation structure. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, a support for electronic components, and a provider of electrical connections for electronic components. PCB boards are widely used in the prior art. It is well known that electronic components will generate heat during work, so the heat dissipation of the PCB board is an important indicator. Taking the single-sided PCB board commonly used in the prior art as an example, as attached figure 1 As shown in , it includes a conductive layer 001, an insulating layer 002, and a heat dissipation layer 003 (it also includes conventional layers such as a printing layer during specific implementation). The insulating layer 002 ...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K1/03
Inventor 陈伟杰
Owner 陈伟杰