led cooling device and street lamp

A technology of heat dissipation device and LED bulb, which is applied to lighting devices, cooling/heating devices of lighting devices, fixed lighting devices, etc., can solve the problems of heat dissipation effect of LED lighting light source, etc. Stable cooling effect

Active Publication Date: 2017-06-06
潘忠勋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The key point of the present invention is to solve the problem of the heat dissipation effect of the existing LED lighting source, which can be realized by improving the specific structural scheme

Method used

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  • led cooling device and street lamp
  • led cooling device and street lamp
  • led cooling device and street lamp

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Embodiment Construction

[0035] In order to further understand the structure of the present invention, it is further described as follows in conjunction with the accompanying drawings of the embodiments;

[0036] figure 1 It is the basic structure of the LED cooling device and the street lamp. Suitable for tall two-way road lighting occasions. It mainly includes a top cover seat 4, a light pole 13, an upper light pole 13a, a fan blade self-rotating wheel 1, a pull rod 2 and its shaft nail hole 3, a top cover seat 4, a light upper cover 7, a fan 5 and a temperature sensor 6. Composed of luminaires with heat sinks. The shaft nail hole 3 of the street lamp bracket is used for shaft nail connection, and the pull rod 2 is installed on the corresponding bottom or both sides of the lamp. Around the rotation of the lamp support shaft 4a, the pull rod 2 is folded to close the lamp, and at the position of the rib 7b, it is fixed with a pin shaft after being folded up and down correspondingly, and is stored i...

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Abstract

Heat radiation problem of a light emitting diode (LED) chip is a key point of the technology, and bad heat radiation can directly influence the service life and light efficiency of an LED, so that a large aluminum alloy die-casting heat radiating sheet is generally arranged on the upper part of an LED lamp, the LED is cooled down by utilizing the air convection, the size of the heat radiating sheet is larger when the power of the LED is greater, the cost by adopting a heat radiating pipe is high, for example, a streetlamp adopting the heat radiation way, dust and bird shit are accumulated in the heat radiating sheet as time goes by, the heat radiating effect is greatly reduced, and on the other hand a heat radiating substrate and a bonding material are critical for the heat radiation of the LED. The invention provides a light emitting diode (LED) heat radiating device and a streetlamp. The streetlamp consists of a lamp holder frame, an upper housing, a supporting plate and an LED bulb. By adequately utilizing different physical phenomena, combining the principles of calorifics and hydromechanics, the heat produced by the chip is brought away in time, a transient temperature field on the upper part of a heat guide plate is improved by utilizing the reverse thinking of the heat radiation, so that the airflow is accelerated, a rapid heat radiation effect can be realized, an energy-saving effect can be realized by utilizing a simple scientific principle, and the product can really realize a low-carbon, energy-saving, environment-friendly, high-quality and inexpensive effect.

Description

technical field [0001] The invention belongs to lighting fixtures. Background technique [0002] Prior to this, the heat dissipation problem of LED chips was a key technical problem. If the heat dissipation is not good, it will directly affect the life of the LED lamp, which will accelerate the light decay and shorten the life of the LED lamp, and burn the chip and peripheral devices if it is serious. Usually, the upper part of the LED lamp has a large aluminum alloy die-casting heat sink, which uses air convection to reduce the temperature. The greater the power of the LED, the larger the heat dissipation "hat"; on the other hand, the heat dissipation substrate and bonding material are also LED The key to heat dissipation is generally to use thermally conductive adhesive, but the thermal conductivity of thermally conductive adhesive is poor. Switching to conductive silver paste will increase the brightness and generate too much heat at the same time. Moreover, some costs a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/74F21V29/83F21V17/12F21V17/16F21S8/08F21W131/103F21Y115/10F21V29/67F21V29/70
Inventor 潘忠勋潘战海潘战宇
Owner 潘忠勋
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