Macromolecule heat conduction material

A heat-conducting material and polymer technology, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve problems affecting the performance and life of electronic products, dry cracking and powdering of heat-conducting paste, short effective life of heat-conducting paste, etc., to achieve Wide application value and market space, not easy to decompose, excellent aging performance

Inactive Publication Date: 2013-04-24
QINGDAO YANBOO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the effective life of the thermal paste on the market is generally short. During the repeated heating and cooling process of electronic devices, small molecules gradually volatilize and seep out. In addition to polluting the device, the thermal paste itself will gradually dry, crack and powder due to the change in the proportion of components, and the thermal conductivity will be reduced. , seriously affect the performance and life of electronic products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A thermally conductive polymer material, the material is composed of the following raw materials in parts by weight: 100 parts polycondensate of hydroxyl-terminated polymethylsilane and methacryloxypropyl trimethoxysilane, 10 parts hydrogen-containing silicone oil curing agent , 5 parts of acrylic acid copolymerized defoamer, 6 parts of benzophenone, 2 parts of hexafluorobutyl methacrylate, 1 part of chloroplatinic acid-divinyltetramethylsiloxane complex.

Embodiment 2

[0023] A thermally conductive polymer material, said material is composed of the following raw materials in parts by weight: 120 parts polycondensate of hydroxyl-terminated polymethylsilane and methacryloxypropyl trimethoxysilane, 30 parts hydrogen-containing silicone oil curing agent , 10 parts of vinyl polymer defoamer, 15 parts of benzophenone, 5 parts of hexafluorobutyl acrylate, 5 parts of chloroplatinic acid-diethyl phthalate complex.

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PUM

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Abstract

The invention relates to a macromolecule heat conduction material. The material is composed of raw materials comprising, by weight part ratio, 100-200 parts of ethylene organic silicon resin, 10-30 parts of curing agent, 5-10 parts of antifoaming agent, 6-15 parts of initiating agent, 2-5 parts of diluting agent and 1-5 parts of catalytic agent. The macromolecule heat conduction material is low in oil extraction rate, excellent in aging characteristic, stable in performance, good in heat resistance and difficult to decompose under high temperature, and has wide application value and market space.

Description

technical field [0001] The invention relates to a polymer heat-conducting material. Background technique [0002] The polymer thermally conductive materials developed in recent years can be generally divided into two categories: non-cured thermally conductive paste and cured thermally conductive adhesive / sheet. Among them, the application process of thermal paste is simple, the operation is quick and convenient, the coating efficiency is high, and it is easy to keep up with the production rhythm of the electronics industry, so it is widely used. However, the effective life of the thermal paste on the market is generally short. During the repeated heating and cooling of electronic devices, small molecules gradually volatilize and seep out. In addition to polluting the device, the thermal paste itself will gradually dry, crack and powder due to changes in the proportion of components, and the thermal conductivity will be reduced. , Seriously affect the performance and life of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/10C09K5/14
Inventor 陈云鹏关颖宋玉东
Owner QINGDAO YANBOO ELECTRONICS
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