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System for digital deposition of pad / interconnects coatings

A technology of protective coating and solder, applied in the application of non-metallic protective layer, printed circuit, printing, etc., can solve the problems of energy waste, pollution, high cost, and achieve the effect of allowing solderability

Inactive Publication Date: 2013-05-08
CAMTEK LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

They incur energy waste and involve pollution that must be dealt with after their use
These methods are costly and require controlled pollutant treatment

Method used

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  • System for digital deposition of pad / interconnects coatings
  • System for digital deposition of pad / interconnects coatings
  • System for digital deposition of pad / interconnects coatings

Examples

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Embodiment Construction

[0055] In the following detailed description, several specific details are given in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

[0056] A method is provided that may include digital pad coatings using various materials such as metals, organic polymers, and the like.

[0057] A high-efficiency printing system can digitally print copper protective coating ink instead of dipping the entire PCB in multiple large pools. The system may include a copper overcoat printing unit arranged to print the copper overcoat ink using selective printing such that the copper overcoat ink is printed at desired locations without the need to immerse the entire PCB in a pond occupying land.

[0058]...

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PUM

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Abstract

A method and a system for printing patterns on an object are provided. The system may include a copper protective coating printing unit arranged to print copper protective coating ink on the object to provide at least one copper protective coating ink pattern. The system may include zero or more additional printing units selected out of a solder mask printing unit arranged to print solder mask ink on the object to provide at least one solder mask pattern and a notation mark printing unit arranged to print notation mark ink on the object to provide at least one notation mark pattern. The system also includes at least one curing unit arranged to cure each ink printed by each printing unit.

Description

[0001] related application [0002] This application claims priority to US Provisional Patent 61 / 427,218, filed December 27, 2010, which is hereby incorporated by reference. Background technique [0003] A printed circuit board (PCB) composed of a certain substrate material, selectively covered by conductive traces and partially covered by an insulating layer, is used in electronics manufacturing as a basis for interconnecting various electronic components that perform a desired function. Final products include many materials produced in complex and aggressive manufacturing processes during which PCBs are subjected to chemicals, thermal and mechanical stress, and other forces. [0004] The conductive traces on these PCBs are usually made of copper and are coated with an insulating material called "solder mask" or "solder resist" in order to protect the copper traces. Certain portions of the copper that are designed to electrically and mechanically attach electrical components...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/01H05K3/28
CPCH05K2203/013H05K2203/1484H05K3/282H05K3/3452H05K2201/09918
Inventor M·伊拉齐A·莱维E·伊格尼尔
Owner CAMTEK LTD