Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for separating multiple dies and processing apparatus for separating multiple dies

A technology for processing equipment and bare chips, which is applied in the field of processing equipment for separating multiple bare chips, and can solve problems affecting electrical functionality and chip reliability

Active Publication Date: 2016-07-06
INFINEON TECH AG
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sawing can lead to effects such as chipping and crack formation, which in turn can affect chip reliability or even electrical functionality

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for separating multiple dies and processing apparatus for separating multiple dies
  • Method for separating multiple dies and processing apparatus for separating multiple dies
  • Method for separating multiple dies and processing apparatus for separating multiple dies

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0073] According to an embodiment, the chip package includes bonding wires.

[0074] According to an embodiment, a chip package includes a chip carrier for carrying a die.

[0075] According to embodiments, the method may further include removing fill material from the one or more spaces separating the plurality of dies.

[0076] According to an embodiment, the method may further include removing one or more layers from one or more spaces separating the plurality of dies.

[0077] A processing apparatus for separating a plurality of dies is provided, the processing apparatus comprising: a separation device configured to selectively remove one or more portions from a carrier comprising the plurality of dies to selectively remove separating a plurality of dies by one or more portions between the dies; a deposition apparatus configured to subsequently form at least one metallization for encapsulating the dies on the backside of the dies layers; packaging means for packaging the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for separating a plurality of dies is provided. The method may include: selectively removing one or more portions from a carrier including a plurality of dies, for separating the plurality of dies along the selectively removed one or more portions, wherein the one or more portions are located between the dies; and subsequently forming over a back side of the dies, at least one metallization layer for packaging the dies

Description

technical field [0001] Embodiments generally relate to methods for separating a plurality of dies and processing equipment for separating a plurality of dies. Background technique [0002] Dies (eg, semiconductor dies such as semiconductor chips) are typically separated from the wafer by dicing the wafer. Traditionally, dies are separated from each other by sawing the wafer. Sawing can lead to effects such as chipping and crack formation, which in turn can affect chip reliability or even electrical functionality. Contents of the invention [0003] Various embodiments provide a method for separating multiple dies. The method may include selectively removing one or more portions from a carrier comprising a plurality of dies, to separate the plurality of dies along the selectively removed one or more portions, wherein the one or more portions between the dies; and subsequently forming at least one metallization layer on the backside of the dies for encapsulating the dies. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L24/03H01L21/6835H01L21/78H01L24/05H01L2221/68354H01L2224/03002H01L2224/03464H01L2224/04026H01L2224/05023H01L2224/05147H01L2224/05568H01L2224/05573H01L2224/05644H01L2224/05647H01L2224/32225H01L2924/00014H01L2924/01322H01L2924/1301H01L2924/1305H01L2924/1306Y10T29/49002
Inventor 赫尔穆特·布伦纳曼弗雷德·恩格尔哈德特
Owner INFINEON TECH AG