Debug system, electronic control unit, information processing unit, semiconductor package, and transceiver circuit
A technology of electronic control unit, transceiver circuit, applied in the technical field used by information processing unit, capable of solving problems such as error control
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no. 1 example
[0035] figure 1 is a block diagram illustrating a configuration of a debugging system 1 for developing an information processing unit provided by the present invention. Used when testing before an engine, etc. to be developed is installed in an actual vehicle (full vehicle) figure 1 The system configuration shown in . refer to figure 1, a debugging system 1 for testing an engine before it is installed in an actual vehicle includes an engine test bench room 2 and a test control room 3 . The engine test bench room 2 includes an engine (control object) 4 and an ECU (electronic control unit) 5 . The test control room 3 includes external units 6 and a host computer 7 for development.
[0036] Such as figure 1 As shown in , the engine test bench chamber 2 is coupled to the test control chamber 3 using long distance wires 8 . Data for commissioning and measurements are exchanged via long-distance conductors 8 . In the first embodiment, the ratio of the distance between the eng...
no. 2 example
[0060] A second embodiment of the present invention will now be described. Figure 5 is a block diagram illustrating the configuration of the debugging system 1 according to the second embodiment. Such as Figure 5 As shown in , the debug system 1 according to the second embodiment is configured such that the transceiver circuit 13 is arranged outside the ECU 5 . When the ECU 5 is provided as a case, the ECU case accommodates various devices including the target microcomputer 12 . Such an ECU case may not be able to provide an installation space for the transceiver circuit 13 for communication.
[0061] The debug system 1 according to the second embodiment is configured such that the transceiver circuit 13 is arranged as an external part to solve the above problems. Since the target microcomputer 12 is located at a distance from the transceiver circuit 13, an increased burden can be placed on the target microcomputer 12 to maintain the performance of the communication. How...
no. 3 example
[0064] A third embodiment of the present invention will now be described. Figure 6 is a block diagram illustrating the configuration of the debugging system 1 according to the third embodiment. In the debugging system 1 according to the third embodiment, the target microcomputer 12 installed in the ECU 5 is formed of a SIP (System in Package). Such as Figure 6 As shown in , the microcomputer chip 15 in the target microcomputer 12 according to the third embodiment is formed of a single semiconductor device (IC chip). Similarly, the transceiver circuit chip 16 is formed of a single semiconductor device (IC chip), which is separate from the microcomputer chip 15 .
[0065] In the debugging system 1 according to the third embodiment, the target microcomputer 12 is provided as a SIP. Therefore, it is not necessary to perform a process of sealing the transceiver circuit chip 16 into another package. In addition, the configuration employed in the third embodiment enables the mi...
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