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Induction heating device and induction heating method

An induction heating device and induction heating technology, which are applied in induction heating, induction heating control, electric heating device and other directions, can solve the problems of difficulty in practical application and the wafer 4 cannot be heated equally, and achieve the effect of high-precision equal heating

Active Publication Date: 2015-08-05
MITSUI E&S MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the wafer 4 cannot be uniformly heated, and it is difficult to put it into practical use.

Method used

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  • Induction heating device and induction heating method
  • Induction heating device and induction heating method
  • Induction heating device and induction heating method

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Embodiment Construction

[0045] Hereinafter, embodiments of the induction heating device and the induction heating method of the present invention will be described in detail with reference to the drawings.

[0046] First, refer to figure 1 , figure 2 , The first embodiment of the induction heating device of the present invention will be described in detail with reference to the drawings. here, figure 1 It is a block diagram showing the front configuration of the induction heating device of this embodiment. in addition, figure 2 It is a figure which shows the planar structure of the susceptor which comprises an induction heating apparatus.

[0047]The induction heating device 10 of the present embodiment includes at least a base 12 as a heat generating body, an induction heating coil 18 , and a power supply unit 20 . The susceptor 12 of the present embodiment is a circular flat plate composed of members 14 (14a to 14c) to be heated by induction and a holder 16, on which a semiconductor wafer ...

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Abstract

To provide an induction heating apparatus that employs a batch-type heating system for heating a large-diameter wafer and can perform uniform heating with a high precision, an induction heating apparatus (10) that heats an inductive-heating target member using a magnetic flux generated from a solenoid-type induction heating coil (18) and heats a wafer (40) using the heat generated from the inductive-heating target member, wherein a plurality of inductive-heating target members 14 (14a, 14b, and 14c) of which principal surface is arranged perpendicularly to a core axis direction of the induction heating coil (18) are interspersed. In the induction heating apparatus (10) described above, a susceptor (12) may be configured by housing the inductive-heating target member (14) in a single holder (16) made of a member having magnetic permeability and heat conductivity.

Description

technical field [0001] The present invention relates to an induction heating device and an induction heating method, and particularly relates to an induction heating device and an induction heating method suitable for uniformly heating an object to be heated. Background technique [0002] Rapid wafer heating continues to accelerate with the introduction of induction heating technology in the field of semiconductor heating. In recent years, the increase in the diameter of wafers to be heated has attracted attention, and in large wafers, the become the status quo. As shown in Patent Document 1, such large-diameter wafers are generally heated one by one by induction heating coils disposed along the surface of a susceptor as a heating element for heating the wafer. [0003] On the contrary, in order to realize the efficiency of heat treatment, such as Figure 11 As shown, ideally is an induction heating device 1 employing a so-called batch-type heating method using a side-arr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H05B6/36H05B6/06
CPCH01L21/67103H05B6/105H05B6/36H05B6/44H05B6/42H05B6/06
Inventor 内田直喜
Owner MITSUI E&S MACHINERY CO LTD