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Induction heating apparatus and induction heating method

An induction heating device, induction heating technology, applied in induction heating, induction heating control, electric heating device, etc., can solve the problems that it is difficult to be practical, and the wafer 4 cannot be heated equally, and achieve the effect of high-precision equal heating

Active Publication Date: 2013-06-12
MITSUI E&S MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the wafer 4 cannot be uniformly heated, and it is difficult to put it into practical use.

Method used

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  • Induction heating apparatus and induction heating method
  • Induction heating apparatus and induction heating method
  • Induction heating apparatus and induction heating method

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Embodiment Construction

[0045] Hereinafter, embodiments of the induction heating device and the induction heating method of the present invention will be described in detail with reference to the drawings.

[0046] First, refer to figure 1 , figure 2 , The first embodiment of the induction heating device of the present invention will be described in detail with reference to the drawings. here, figure 1 It is a block diagram showing the front configuration of the induction heating device of this embodiment. in addition, figure 2 It is a figure which shows the planar structure of the susceptor which comprises an induction heating apparatus.

[0047]The induction heating device 10 of the present embodiment includes at least a base 12 as a heat generating body, an induction heating coil 18 , and a power supply unit 20 . The susceptor 12 of the present embodiment is a circular flat plate composed of members 14 (14a to 14c) to be heated by induction and a holder 16, on which a semiconductor wafer ...

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Abstract

Provided is an induction heating apparatus, which employs a batch-type heating system for heating wafers having an increased diameter, and which can perform highly accurate uniform heating. The induction heating apparatus (10) heats, by means of a magnetic flux generated by means of a solenoid-type induction heating coil (18), members to be inductively heated, and heats wafers (40) with heat generated by means of the members inductively heated. The induction heating apparatus is characterized in that a plurality of members (14 (14a, 14b, 14c)) to be inductively heated are disposed by being scattered, such that the main surface of each of the members is perpendicular to the axis center direction of the induction heating coil (18). In the induction heating apparatus (10) having such feature, it is recommended that a susceptor (12) is configured by housing the members (14) in one holder (16) configured of a member that is provided with magnetic permeability and heat conductivity.

Description

technical field [0001] The present invention relates to an induction heating device and an induction heating method, and particularly relates to an induction heating device and an induction heating method suitable for uniformly heating an object to be heated. Background technique [0002] Rapid wafer heating continues to accelerate with the introduction of induction heating technology in the field of semiconductor heating. In recent years, the increase in the diameter of wafers to be heated has attracted attention, and in large wafers, the become the status quo. As shown in Patent Document 1, such large-diameter wafers are generally heated one by one by induction heating coils disposed along the surface of a susceptor as a heating element for heating the wafer. [0003] On the contrary, in order to realize the efficiency of heat treatment, such as Figure 11 As shown, ideally is an induction heating device 1 employing a so-called batch-type heating method using a side-arr...

Claims

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Application Information

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IPC IPC(8): H05B6/36H05B6/06
CPCH05B6/105H05B6/36H05B6/42H05B6/44H05B6/06H01L21/67103
Inventor 内田直喜
Owner MITSUI E&S MACHINERY CO LTD