Resin capable of directly formed by laser and preparation method thereof

A technology of laser direct molding and resin, which is applied in the field of mobile phone and notebook computer antennas, and can solve the problems of inability to make light-colored products and degradation

Active Publication Date: 2013-12-18
SHANGHAI KUMHO SUNNY PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The advantage of spinel copper compounds is that electroless plating is fast, but copper is a depolymerization agent for PC, whic

Method used

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  • Resin capable of directly formed by laser and preparation method thereof
  • Resin capable of directly formed by laser and preparation method thereof
  • Resin capable of directly formed by laser and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Weigh each component by weight, see Table 1 for details, wherein the matrix resin is PC, weight ratio: FN220067, AG1950 30.

[0031] Mix all raw materials in a medium speed mixer for 20 minutes, extrude through a twin-screw extruder with a melting temperature of 200-280°C, and granulate. The temperature of each zone is: the temperature of zone 1-2 of the twin-screw extruder is 200-280°C, the temperature of zone 3-4 is 200-280°C, the temperature of zone 5-6 is 200-280°C, and the temperature control is 7- The temperature in Zone 8 is 200-280°C, and the temperature in Zone 9-10 is 200-280°C.

Embodiment 2

[0033] Weigh each component by weight, see Table 1 for details, wherein the matrix resin is PC, weight ratio: FN220065, AG1950 30.

[0034] Mix all raw materials in a medium speed mixer for 20 minutes, extrude through a twin-screw extruder with a melting temperature of 200-280°C, and granulate. The temperature of each zone is: the temperature of zone 1-2 of the twin-screw extruder is 200-280°C, the temperature of zone 3-4 is 200-280°C, the temperature of zone 5-6 is 200-280°C, and the temperature control is 7- The temperature in Zone 8 is 200-280°C, and the temperature in Zone 9-10 is 200-280°C.

Embodiment 3

[0036] Weigh each component by weight, see Table 1 for details, wherein the matrix resin is PC, weight ratio: FN220063, AG1950 30.

[0037] Mix all raw materials in a medium speed mixer for 20 minutes, extrude through a twin-screw extruder with a melting temperature of 200-280°C, and granulate. The temperature of each zone is: the temperature of zone 1-2 of the twin-screw extruder is 200-280°C, the temperature of zone 3-4 is 200-280°C, the temperature of zone 5-6 is 200-280°C, and the temperature control is 7- The temperature in Zone 8 is 200-280°C, and the temperature in Zone 9-10 is 200-280°C.

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Abstract

The invention relates to a resin capable of directly formed by laser and a preparation method thereof. The resin is prepared from the following raw materials in parts by weight: 93-97 parts of a matrix resin, 3-7 parts of a laser sensitive additive, and 0.1-0.9 part of other components. The preparation method comprises the following steps: weighting the raw materials in parts by weight: mixing the matrix resin, the laser sensitive additive and other components in a medium-speed mixer to mix for 20 minutes; and placing the obtained mixture into a twin-screw extruder, and then carrying out melting extrusion and granulating on the obtained product. Compared with the prior art, the resin disclosed by the invention mainly broadens the scope of laser sensitive additives which are no longer limited to spinel structured compounds, has small possibility of causing PC degradation, and can be prepared into various light-color products.

Description

technical field [0001] The invention relates to a laser direct forming resin and a preparation method thereof, which are widely used in the fields of antennas of mobile phones and notebook computers, and the like. Background technique [0002] Laser Direct Structuring, or Laser Direct Structuring, referred to as LDS, is a 3D-MID (Three-dimensional molded interconnect device) production technology that combines injection, laser processing and electroplating. Endow the electrical interconnection function, so that in addition to the functions of support and protection, the plastic shell and structural parts can be combined with the conductive circuit to produce shielding, antenna and other functions. To put it simply, on the injection-molded plastic bracket, the three-dimensional metal circuit is directly plated on the bracket by using laser technology, so that the plastic bracket has certain electrical properties. This technology can be applied to mobile phone antennas, autom...

Claims

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Application Information

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IPC IPC(8): C08L69/00C08L55/02C08K13/02C08K3/22B29C47/92B29C48/92
CPCB29C48/40
Inventor 杨春华李强罗明华辛敏琦
Owner SHANGHAI KUMHO SUNNY PLASTICS
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