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Pressure controller, polishing apparatus having the pressure controller, and polishing method

Through the dual cycle control system, the second pressure sensor and the PID control unit are used to generate correction command values, which solves the problem of the pressure sensor output value being affected by factors such as temperature drift, achieves high-precision fluid pressure control, and ensures consistent pressure during the grinding process. performance and accuracy.

Active Publication Date: 2014-02-12
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since the grinding pressure for the wafer is controlled based on a pressure different from the actual pressure, sometimes a desired grinding result cannot be obtained.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Embodiments of the present invention will be described below with reference to the drawings.

[0040] image 3 It is a figure which shows the grinding|polishing apparatus provided with the pressure control apparatus which concerns on one Embodiment of this invention. like image 3 As shown, the polishing apparatus has: a polishing table 22 supporting a polishing pad 23;

[0041] The polishing table 22 is connected to a table motor 29 disposed below it via a table shaft 22a, and is rotatable around the table shaft 22a. The polishing pad 23 is attached to the upper surface of the polishing table 22 , and the surface 23 a of the polishing pad 23 constitutes a polishing surface for polishing the wafer W. As shown in FIG. A polishing liquid supply mechanism 25 is disposed above the polishing table 22 , and the polishing liquid Q is supplied to the polishing pad 23 on the polishing table 22 by the polishing liquid supply mechanism 25 .

[0042] The top ring 30 has a top r...

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PUM

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Abstract

Provided is a pressure controller, polishing apparatus having the pressure controller, and polishing method. The pressure controller includes: a pressure-regulating valve configured to regulate pressure of a fluid supplied from a fluid supply source; a first pressure sensor configured to measure the pressure regulated by the pressure-regulating valve; a second pressure sensor located downstream of the first pressure sensor; a PID controller configured to produce a correction pressure command value for eliminating a difference between a pressure command value and a pressure value of the fluid measured by the second pressure sensor; and a regulator controller configured to control operation of the pressure-regulating valve so as to eliminate a difference between the correction pressure command value and a pressure value of the fluid measured by the first pressure sensor. The pressure controller can eliminate a difference of a pressure measuring value caused by the temperature shift of a pressure sensor and raise the precision of liquid pressure regulation.

Description

technical field [0001] The present invention relates to a pressure control device for controlling the pressure in a pressure chamber for pressing a substrate such as a wafer onto a polishing pad. Furthermore, the invention relates to a grinding device having such a pressure control device. Furthermore, the present invention relates to a grinding method using the above-mentioned grinding device. Background technique [0002] figure 1 is a schematic diagram showing a polishing apparatus for polishing wafers. like figure 1 As shown, the polishing apparatus has a polishing table 22 that supports a polishing pad 23 , and a top ring 30 that presses a wafer W onto the polishing pad 23 . The grinding table 22 is connected to a table motor 29 disposed below it via a table shaft 22a, and the table motor 29 rotates the polishing table 22 in the direction indicated by the arrow. A polishing pad 23 is attached to the upper surface of the polishing table 22 , and the upper surface of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005B24B37/10
CPCB24B37/345B24B7/228B24B37/005Y10T137/7761B24B7/22B24B37/34B24B49/00G05D16/20H10P52/00
Owner EBARA CORP