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Radiating device of integrated cloud computing server

A cloud computing server and heat dissipation device technology, applied in computing, instruments, electrical digital data processing, etc., can solve problems affecting computing speed and poor cooling effect, reduce consumables and maintenance costs, and ensure cooling performance and computing power Effect

Inactive Publication Date: 2014-02-12
成都亿友科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat dissipation of medium and small cloud computing servers is a very important issue. If the existing server heat dissipation method is adopted, that is, a fan dissipates heat to the motherboard, the heat dissipation effect will be poor and the computing speed will be affected.

Method used

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  • Radiating device of integrated cloud computing server
  • Radiating device of integrated cloud computing server

Examples

Experimental program
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Embodiment Construction

[0011] The present invention will be further described below in conjunction with accompanying drawing:

[0012] Such as figure 1 with figure 2 As shown, the integrated cloud computing server of the present invention includes a housing 13, a computing circuit board 3, and the heat dissipation device includes a fan bracket 17 and a fan 21. The bottom plate 11 of the housing 13 and the side plates 12 on both sides jointly form a The accommodating space 10, the inner wall of the side plate 12 is provided with a plurality of sets of slots 8, the slots 8 are formed by connecting the bent support piece 9 with the inner wall of the side plate 12 through the connecting body 7, and the outer ends of the slots 8 are on both sides Locks 14 are provided respectively, and the computing circuit board 3 is placed on the support piece 9 in the slot 8; the fan bracket 17 is installed in the middle of the accommodation space 10, and the two ends of the fan bracket 17 are respectively installed...

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Abstract

The invention discloses a radiating device of an integrated cloud computing server. The integrated cloud computing server comprises a casing and operational circuit boards. A bottom plate and side plates on the two sides of the casing form an accommodation space together. The radiating device comprises a fan support and fans. The fan support is mounted in the middle of the accommodation space, two ends of the fan support are mounted on the side plate inner walls of the two sides, and the fans are mounted on the fan support. According to the radiating device, centralized radiating is performed on a plurality of the operational circuit boards through combined fans, so that consumed materials and maintenance costs of the whole product are reduced, and the radiating performance and the operation capacity of the cloud computing server are guaranteed.

Description

technical field [0001] The invention relates to a heat dissipation device for a cloud computing server, in particular to a heat dissipation device for a medium and small-sized integrated cloud computing server with high integration and good heat dissipation performance. Background technique [0002] Cloud computing server is not a single server, it is a server cluster, the biggest advantage is elastic expansion, other functions and advantages are: virtualization, reliability, scalability, on-demand service, ease of operation, super large scale, Versatility, security. Most of the existing cloud computing servers are large-scale server clusters, connecting multiple single servers together, and coordinating through software to make these servers coordinate their work. But for some industries, medium and small cloud computing servers are required for security reasons. At present, there is a lack of such medium and small cloud computing servers between large cloud computing ser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 赵小元谭顺川
Owner 成都亿友科技有限公司
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