Chip defect detection method

Abstract

The invention discloses a chip defect detection method, comprising the following steps of: providing a chipset to be detected and a defect detection device; respectively introducing ion implantation circuit diagrams of different kinds of devices on each chip of the chipset to be detected into the defect detection device; respectively setting defect detection conditions of the different kinds of devices, scanning each chip of the chipset to be detected in order based on the ion implantation circuit diagrams of each kind of devices and the defect detection conditions corresponding to the kind of devices by the defect detection device, and storing the scanning result; and respectively comparing the scanning results of the same kind of devices of the adjacent chips in the chipset to be detected to determine the defect position. The ion implantation circuit diagrams of different devices on the chip are introduced into the defect detection device, and different detection conditions are set based on the different devices, thereby avoiding a problem of very much noise generated in the normal detection.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for detecting chip defects. Background technique [0002] The advanced integrated circuit manufacturing process generally includes hundreds of steps, and a small error in any link will lead to the failure of the entire chip, especially as the critical size of the circuit continues to shrink, the requirements for process control become stricter, so In order to find and solve problems in time during the production process, optical and electronic defect detection equipment is generally equipped to carry out online detection of products. [0003] Whether it is optical or electronic defect detection, the basic principle of its work is to obtain the signals of several chips through the equipment, and then compare the data. Figure 1-Figure 3 It is a schematic diagram of defect detection in the background technology of the present invention, figure 1 It is...

AI Technical Summary

Problems solved by technology

[0008] Aiming at the above existing problems, the present invention discloses a defect detection method to overcome that in the prior art, different devices on the chip use the same defect detection condition for defect detection, and some devices may be under this defect detection condition In an unstable state, the brightness and darkness of the contact holes of the same device on the chip are very different, resulting in a lot of noise generated during defect detection and normal defect detection and analysis cannot be performed

Images