Lateral LED and packaging method for lateral LED
A side-emitting diode technology, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve problems that affect the service life of side light-emitting diodes and are easy to break, and achieve the effect of ensuring service life and not being easy to break
Active Publication Date: 2014-03-26
阿利斯教育装备科技(苏州)有限公司
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Problems solved by technology
When the surface mount technology is used to fix the side light-emitting diode to the circuit board, the packaging component will be subjected to a certain external force. Due to the difference in ductility and material properties between the lead structure of the plastic material and the metal material, the first electrode It is easy to break between the second electrode and the second electrode, thus affecting the service life of the side light emitting diode
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[0018] The side light emitting diodes 100 and 200 of the present invention will be further described in detail below with reference to the accompanying drawings.
[0019] see Figure 1 to Figure 3 The side LED 100 of the first embodiment of the present invention includes a lead structure 10 , a reflective cup 20 disposed on the lead structure 10 , a light emitting element 30 , and an encapsulation layer 40 covering the light emitting element 30 .
[0020] Specifically, the pin structure 10 includes a first electrode 11 and a second electrode 12 . The two electrodes 11 , 12 are separated from each other to form a gap 50 , and the gap 50 is filled with an insulating material to form a substrate 60 . Each electrode 11 includes a first surface 13 and a second surface 14 opposite to the first surface 13 .
[0021] The first electrode 11 includes a first body portion 111, a first protruding portion 112 extending from one side of the first body portion 111 in the width direction to...
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A lateral LED includes a lead structure, a light-emitting element, and a packaging layer covering the light-emitting element, wherein the lead structure includes a first electrode and a second electrode which are spaced from each other, the light-emitting element are electrically connected with both the first electrode and the second electrode, and the first electrode and the second electrode are arranged in a staggered manner on a surface parallel to a light-emitting surface. As the first electrode and the second electrode are arranged in a staggered manner on the surface parallel to the light-emitting surface, the two protruding parts which are arranged in a staggered manner can bear an external force applied on the LED, which can prevent the external force from being concentrated on a same straight line, achieve low possibility of breakage of a gap between the two metal electrodes filled with plastic materials, and further guarantee the service life of the lateral LED. The invention further relates to a packaging method for the lateral LED.
Description
technical field [0001] The invention relates to a semiconductor and a packaging method thereof, in particular to a side light emitting diode and a packaging method thereof. Background technique [0002] Light Emitting Diode (LED) is a semiconductor element that can convert current into light in a specific wavelength range. With its advantages of high luminous efficiency, small size, light weight, and environmental protection, it has been widely used in current in various fields. Before the light-emitting diode is applied to the above fields, the light-emitting diode chip needs to be packaged to protect the light-emitting diode chip. [0003] When packaging in the industry, a pin structure is provided to be electrically connected to the LED, and the pin structure includes a first electrode and a second electrode. For a general side light emitting diode, the first electrode and the second electrode are usually arranged in a regular cuboid shape and spaced apart from each oth...
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IPC IPC(8): H01L33/62H01L33/48
CPCH01L33/486H01L33/387H01L2224/48091H01L33/62H01L2224/48247H01L2924/00014H01L33/48
Inventor 林厚德张超雄陈滨全陈隆欣曾文良
Owner 阿利斯教育装备科技(苏州)有限公司