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Mask structure, apparatus and method for depositing layers on a substrate

A technology for depositing layers and substrates, which can be used in coatings, solid-state diffusion coatings, metal material coating processes, etc., and can solve the problems of different and complex deposition materials.

Active Publication Date: 2017-07-11
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The effect of an uncoated mask versus a coated mask can be quite complex and may vary depending on the deposition material

Method used

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  • Mask structure, apparatus and method for depositing layers on a substrate
  • Mask structure, apparatus and method for depositing layers on a substrate
  • Mask structure, apparatus and method for depositing layers on a substrate

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Embodiment Construction

[0019] Reference will now be made in detail to various embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals designate the same elements. Generally speaking, only the differences between the various embodiments are described. Each example provided is only for explaining the present invention, not limiting the present invention. Furthermore, features illustrated or described as part of one embodiment can also be used on or in combination with other embodiments to yield further embodiments. The description includes such modifications and variations.

[0020] According to certain embodiments, a mask structure or "edge exclusion mask" should be understood as a mask covering at least one edge of the substrate to be coated. Generally speaking, a mask can be composed of several parts or portions, and these blocks or portions form a frame, and the frame defi...

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Abstract

A mask structure configured to deposit layers on a rectangular substrate, such as an edge exclusion mask configured to deposit layers on a rectangular substrate, is described herein. The masking structure comprises a masking frame for covering the edge of the substrate during layer deposition, wherein the masking frame comprises at least two masking frame side portions in corner regions between the at least two masking frame side portions A corner is formed, wherein the mask frame is shaped to overlap with the edge of the rectangular substrate such that a first overlap width at a side portion of the mask frame is greater than a second overlap width at a corner area.

Description

technical field [0001] Embodiments of the present invention relate to masks for layer deposition and layer deposition methods using the masks. Embodiments of the invention relate in particular to edge-exclusion masks and layer deposition methods using edge-exclusion masks, specifically to mask structures configured to deposit layers on rectangular substrates, to apparatus for depositing layers on rectangular substrates And a method for depositing layers on a rectangular substrate. Background technique [0002] Several methods are known for depositing materials on substrates. For example, the substrate may be coated by a physical vapor deposition (PVD) process, a chemical vapor deposition (CVD) process, a plasma assisted chemical vapor deposition (PECVD) process, and the like. Generally, the process is carried out in a process apparatus or process chamber where the substrate to be coated is placed. Deposition material is provided in the apparatus. A variety of materials a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/04C23C16/04C23C8/04C23C10/04C23C2/00C23C4/02C23C4/00
CPCC23C8/04C23C10/04C23C14/042C23C16/042C23C4/01C23C2/0064C23C4/02
Inventor M·哈尼卡R·林德伯格C·灿格尔
Owner APPLIED MATERIALS INC