Preparation method of al-si-cu-zn-ti five-element foil-like solder of high volume fraction sicp/al composite

An al-si-cu-zn-ti, high volume fraction technology, applied in the direction of welding/cutting media/materials, manufacturing tools, welding equipment, etc., can solve volatile, poor welding quality, solder and SiC particle combination Inadequate problems, to achieve the effect of convenient preset and guarantee sealing

Active Publication Date: 2016-03-23
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A large amount of SiC ceramic reinforcement phase is exposed on the surface of the high volume fraction SiCp / Al composite material, which contains ionic bonds and covalent bonds, and is difficult to be wetted by the solder containing metal bonds, which brings great difficulty to the brazing process , so the welding of the existing particle-reinforced aluminum matrix composites needs to be carried out at a relatively high temperature, and there is a problem of poor welding quality, which seriously restricts the application range of SiCp / Al composites
[0003] In the patent CN103464927A, the rare earth element Ce is added to the commercial solder Al-5.5Si-28Cu, and the Al-Si-Cu-Ce solder is smelted, which can refine the grains of the solder joint and improve the performance of the solder alloy, but the solder does not have Solve the problem of poor bonding between solder and SiC particles
Patent CN102350553A compared the welding effect of Al-Si-Mg commercial solder welding and direct Al-Si-Mg solder soldering after magnetron sputtering Ti on the surface of the composite material substrate, and found that the coating Ti can form a reaction bond with SiC particles, The brazing effect is good, but the magnetron sputtering Ti step needs to be added on the surface to be welded, and because Mg is volatile, it cannot be made into a foil-shaped solder strip

Method used

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  • Preparation method of al-si-cu-zn-ti five-element foil-like solder of high volume fraction sicp/al composite
  • Preparation method of al-si-cu-zn-ti five-element foil-like solder of high volume fraction sicp/al composite
  • Preparation method of al-si-cu-zn-ti five-element foil-like solder of high volume fraction sicp/al composite

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preparation example Construction

[0036] A method for preparing the Al-Si-Cu-Zn-Ti five-element foil-shaped solder of the above-mentioned high volume fraction SiCp / Al composite material, comprising the steps of:

[0037] Step 1: Raw material surface treatment

[0038]1) The raw material pure Al, Al-20Si alloy and Al-10Ti alloy are cleaned with NaOH solution with a mass fraction of 3-7%, the cleaning time is 10-15s, the temperature of the alkali solution is 40-80°C, and the mass fraction is 20% after washing with clean water. ~40% dilute nitric acid passivation treatment for 10~20s. Then put it into deionized water for rinsing, and finally put it into acetone (purity 99.5%) for ultrasonic cleaning for 3-7 minutes, then take it out and dry it.

[0039] 2) The mass fraction of raw material Cu is 80% HNO 3 Add 10g / L NaCl aqueous solution for pickling for 10-30s. When soaking, completely immerse the welding area of ​​the workpiece to be welded in the solution while turning it over continuously. Then put the mass...

specific Embodiment

[0051] The composition ratio of the Al-Si-Cu-Zn-Ti five-element foil-shaped solder in this embodiment is Al-5Si-24Cu-1.5Zn-1Ti. The calculation method for the mass of each raw material before smelting the alloy will be described in detail below. The total mass of the solder alloy is calculated in 100g, and the required pure copper w 1 = 28 grams, pure zinc w 2 =1.5 gram, secondly according to the mass fraction of silicon is 5% to calculate the mass w of required aluminum-silicon alloy Al-20Si 3 =25 grams, according to the mass fraction of titanium is 1% to calculate the mass w of required aluminum-titanium alloy Al-10Ti 4 =10 grams, finally calculate the mass w of pure Al required 5 =100-w 1 -w 2 -w 3 = 35.5 grams.

[0052] Take out the required raw materials and clean the surface according to the content shown in step 1, and use an electronic balance to weigh 28 grams of pure copper, 1.5 grams of pure zinc, 25 grams of Al-20Si alloy, 10 grams of Al-10Ti alloy, and 35.5 ...

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Abstract

The invention relates to an Al-Si-Cu-Zn-Ti five-element foil-shaped brazing filler material made of high-volume-fraction SiCp / Al composite materials and a preparing method of the Al-Si-Cu-Zn-Ti five-element foil-shaped brazing filler material. The Al-Si-Cu-Zn-Ti five-element foil-shaped brazing filler material is composed of, by weight, 24 percent to 26 percent of Cu, 5 percent to 8 percent of Si, 0.5 percent to 2 percent of Zn, 1 percent to 3 percent of Ti and the balance of Al. The preparing method includes the steps of raw material surface processing, brazing filler material smelting and brazing filler material melt-spinning forming. A good connecting interface can be formed by the Al-Si-Cu-Zn-Ti five-element foil-shaped brazing filler material made of high-volume-fraction SiCp / Al composite materials, an Al base body and SiC reinforcement particles simultaneously at the brazing temperature, and the sealing performance of a welded joint is guaranteed.

Description

technical field [0001] The present invention relates to a kind of preparation method of Al-Si-Cu-Zn-Ti five-element foil-shaped brazing filler metal, especially relate to a kind of Al- The invention discloses a preparation method of Si-Cu-Zn-Ti five-element foil-shaped solder. Background technique [0002] High volume fraction (55%-70%) SiCp / Al has excellent properties such as high specific strength, specific stiffness, wear resistance, corrosion resistance, etc., especially the sufficient source of raw materials and low manufacturing cost, and can be widely used in aerospace, electronic information, industries such as precision machinery. A large amount of SiC ceramic reinforcement phase is exposed on the surface of the high volume fraction SiCp / Al composite material, which contains ionic bonds and covalent bonds, and is difficult to be wetted by the solder containing metal bonds, which brings great difficulty to the brazing process , so the welding of the existing partic...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B23K35/28B23K35/40
CPCB23K35/286B23K35/40
Inventor刘守相徐李刚许寰宇孙峰牛济泰何鹏
OwnerBEIJING INST OF RADIO MEASUREMENT