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Electronic housing for switching devices, in particular for low-voltage switching devices

A technology for switchgear and electronic parts, applied in the field of electronic parts housing, can solve the problem of not providing a pre-concentration device and the like

Inactive Publication Date: 2014-11-05
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Electronics housing of modular construction using half-shell technology, which means that it consists of at least two housing parts that snap into each other, with the disadvantage that no pre-centralization or guides, so these must be inserted by hand

Method used

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  • Electronic housing for switching devices, in particular for low-voltage switching devices

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Embodiment Construction

[0018] FIG. 1 shows an electronic component housing 1 according to the present invention for a switchgear, particularly a low-voltage switchgear, which includes a lower housing part 2 and an upper housing part 3. The upper housing part 3 may preferably be a two-piece structure composed of two housing covers 4 and 5. In the two-piece housing upper part 3, it can be designed according to the present invention that one housing cover 4 is automatically slid onto the housing lower part 2 by means of a pre-concentration device and a guide auxiliary device, and the other housing covers 4 Slide from the other surface to the lower part 2 of the housing. On the other hand, it is also possible that the two housing covers 4, 5 of the upper housing part 3 are first guided to each other and then slid onto the lower housing part 2 by means of a pre-concentration and guiding aid.

[0019] In the interface area 6 between the upper housing part and the lower housing part 2 at the lower housing pa...

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PUM

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Abstract

The invention relates to an electronic housing (1) for switching devices, comprising a housing lower part (2) and a housing upper part (3). The invention is characterized in that a guide (7) is formed in the interface region (6) between the housing upper part (3) and the housing lower part (2) such that the housing upper part (3) can be slid onto the housing lower part (2) in the X direction via the guide (7) in a fully automatic process.

Description

Technical field [0001] The invention relates to an electronic component housing for a switch device with a lower part of the housing and an upper part of the housing. Background technique [0002] Modular electronic components require functionally compatible packaging, which allows different settings and operating functions, and can be installed as simply and safely and reliably as possible. With the increasing trend of control and automated operation processes, especially in the industrial field, and at the same time, when the electronic parts are directly dispersed in the process and the electronic modules are miniaturized into compact and easy-to-assemble devices. As a result, the demand for suitable electronic component housings is constantly increasing, and interface technology is usually integrated in the housing. In this regard, the individual electronic component housings are usually directly assembled on the carrying rail, and are preferably connected to each other and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H9/02H05K5/00
CPCH01H9/0271H01H71/025H01H9/00H01H9/02H05K5/00H01H2223/046H01H2229/022
Inventor 保罗·费勒利希曼努埃尔·盖特纳沃尔夫冈·霍尔默马库斯·迈尔伯恩哈德·里希特
Owner SIEMENS AG