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Method for manufacturing connecting body, and method for connecting electronic component

A technology of electronic components and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as poor connection, uneven display, shrinkage of adhesive, etc.

Active Publication Date: 2014-12-10
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in this connection method using an ultraviolet-curable adhesive, shrinkage of the adhesive also occurs along with hardening by ultraviolet irradiation.
Therefore, due to the contraction, the IC connection portion of the transparent substrate 103 sandwiching the liquid crystal 106 is warped, so that the surface uniformity of the gap between the transparent substrates 102 and 103 in the panel display portion 107 is lost, and the liquid crystal is caused to be warped. Poor concerns such as confusion of orientation and uneven display
In addition, there is a possibility that the connection failure of the IC 115 for liquid crystal driving may be caused due to warping of the IC connection portion of the transparent substrate 103

Method used

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  • Method for manufacturing connecting body, and method for connecting electronic component
  • Method for manufacturing connecting body, and method for connecting electronic component
  • Method for manufacturing connecting body, and method for connecting electronic component

Examples

Experimental program
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Effect test

Embodiment 1

[0097] In Example 1, the elapsed time until the ultraviolet rays are irradiated to the third connection region CH3 is 0 second, and the elapsed time until the ultraviolet rays are irradiated to the first, second, fourth, and fifth connection regions CH1, CH2, CH4, and CH5 Both are set to 1 second. That is, in Example 1, the ultraviolet irradiation time of the third connection region CH3 is 5 seconds, and the ultraviolet irradiation time of the first, second, fourth, and fifth connection regions CH1, CH2, CH4, and CH5 is 4 seconds.

Embodiment 2

[0098] In Example 2, the elapsed time until the ultraviolet rays are irradiated to the third to fifth connection regions CH3 to CH5 is set to 1 second, the elapsed time until the ultraviolet rays are irradiated to the second connection region CH2 is set to 2 seconds, and the ultraviolet rays are irradiated to The elapsed time until the first connection area CH1 is set to 3 seconds. That is, in embodiment 2, the ultraviolet irradiation time of the 3rd~the 5th connection area CH3~CH5 is 4 seconds, the ultraviolet irradiation time of the 2nd connection area CH2 is 3 seconds, the ultraviolet irradiation time of the 1st connection area CH1 is 2 seconds.

Embodiment 3

[0099]In Example 3, the elapsed time until the ultraviolet rays are irradiated to the third connection region CH3 is set to 1 second, the elapsed time until the ultraviolet rays are irradiated to the second and fourth connection regions CH2 and CH4 is set to 2 seconds, and the ultraviolet rays are irradiated to The elapsed time until the first and fifth connection areas CH1 and CH5 is set to 3 seconds. That is, in embodiment 3, the ultraviolet irradiation time of the 3rd connection area CH3 is 4 seconds, the ultraviolet irradiation time of the 2nd, the 4th connection area CH2, CH4 is 3 seconds, the 1st, the 5th connection area CH1, CH5 The UV exposure time is 2 seconds.

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Abstract

The present invention has: a step for arranging an electronic component (18) on a substrate (12) with a light-curing adhesive (3) interposed therebetween; and a step for beaming light onto the adhesive (3) and curing the adhesive (3). The region at which the substrate (12) and the electronic component (18) are connected is divided into a plurality of connection regions (CH1 through CH5). The light-curing adhesive (3) is cured in a manner in which the light-beaming start timing is staggered between each of the connection regions (CH1 through CH5). The cure shrinkage in the light-curing adhesive is minimized, and faulty connection of the electronic component is mitigated.

Description

technical field [0001] The present invention relates to a method for producing a connected body that connects electronic components and the like with a photocurable adhesive, and a method for connecting electronic components with a photocurable adhesive. This application claims priority based on Japanese Patent Application No. Japanese Patent Application No. 2012-68140 for which it applied in Japan on March 23, 2012, By referring this application, it takes in this application. Background technique [0002] Conventionally, liquid crystal display devices have been widely used as various display units such as televisions, PC monitors, mobile phones, portable game machines, tablet PCs, and vehicle monitors. In recent years, such liquid crystal display devices have adopted so-called COG (chip on glass) in which ICs for driving liquid crystals are directly mounted on the substrate of the liquid crystal display panel or a A so-called FOG (film on glass) in which a flexible substra...

Claims

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Application Information

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IPC IPC(8): H05K3/32G09F9/00H01L21/60H05K3/36
CPCH01L2224/83851H01L2224/2939H01L2224/294H01L2224/29344H01L2224/83203H01L2224/29357H01L2224/29371H01L2224/27334H01L2224/83874H01L2224/29386H01L2224/29324H01L2224/29347H01L2224/2732H01L2224/293H01L2224/29355H01L2224/83192H01L24/743H01L2224/29393H05K2203/1476H01L2224/27003H01L2224/29339H01L24/27H01L2224/2929G02F1/13452H01L2224/2936H01L24/32H01L2224/29311H05K3/323H01L2224/29316H01L24/83H01L24/29H01L2224/32227H01L2224/29194
Inventor 稻濑圭亮
Owner DEXERIALS CORP