Lid body portion and electronic device package using the lid body portion and electronic device

Abstract

To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.

Description

technical field [0001] The present invention relates to a lid body, a package for electronic devices using the lid body, and an electronic device. Background technique [0002] In recent years, electronic devices have been required to be miniaturized and thinned (thin, low in height), and to be highly functional. [0003] In general, electronic devices contain electronic device elements that exhibit desired functions in packages for electronic devices. The electronic device package accommodates electronic device components by covering part or all of a circuit board on which an electronic device is mounted with a lid body having a space. [0004] Due to the need for miniaturization and thinning of the electronic device, the space for accommodating the electronic device element inside the package for the electronic device is limited. [0005] And, under the constraints of this space, in order to install more electronic device components with multiple functions or to install ...

AI Technical Summary

Problems solved by technology

Therefore, the edge portion 114 and the side plate inner surface 110 may be in contact with the electronic device components, and it is necessary to be away from the plane length L1 of the edge portion 114 and the plane length L2 of the side plate inner surface 110, so it becomes impossible to expand the installed electronic components. Device Component Size Constraints

[0023] Therefore, it is difficult to increase the electronic device component mounting rate

In addition, there is a limit to making the thickness T3 of the lid body 102 made of glass or ceramics uniformly thinner and thinner.

[0024] In addition, in the conventional examples of the package type using the metal cover type structure disclosed in Patent Documents 3 and 4, there is the above-mentioned Figure 8 According to the dimensional relationship shown, the inner side of the cover body 102 (the inner surface 110 of the side plate with the tapered surface facing the inner side, etc.) may be in contact with the electronic device components

Generally, since the inner side of the cover body 102 needs to be kept away from electronic device components, etc., it becomes a restriction that the size of electronic device components to be mounted cannot be increased.

Therefore, it is difficult to increase the electronic device component mounting rate

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