Resin hole plugging method capable of preventing ink overflow

Abstract

The invention relates to the technical field of resin hole plugging and discloses a resin hole plugging method capable of preventing ink overflow. The method is used for plugging an inner buried hole with a resin and comprises the following steps: 1, press-fitting; 2, drilling a hole: namely forming the inner buried hole; 3, integrally electroplating an inner board; 4, manufacturing an inner pattern: namely making the inner pattern on an electroplated copper layer on the inner board; 5, performing brown oxidation: carrying out brown oxidation on the surface of the electroplated layer; 6, plugging the hole with the resin: plugging the inner buried hole with the resin; 7, sticking the resin: sticking away the resin flowing out of the inner buried hole; 8, curing and baking the board: baking the inner board so as to cure the resin. Original resin hole plugging is replaced by brown oxidation and resin hole plugging. As the wall roughness of the inner buried hole is increased, ink is prevented from flowing out of the inner board, and open-circuit, short-circuit and poor contact phenomena are avoided. The inner pattern is manufactured before the hole is plugged with the resin, so that the subsequent resin sticking operation is convenient to carry out. Through sticking the resin, the problems of expansion and shrinking deformation and uneven thickness of the board surface of the inner board can be avoided.

Description

technical field [0001] The invention relates to the technical field of resin plug holes, in particular to a resin plug hole manufacturing method for preventing ink overflow. Background technique [0002] For printed circuit boards with buried holes in the inner layer, in the production process, it is generally necessary to perform resin plugging on the buried holes in the inner layer, that is, to fill the buried holes in the inner layer with resin ink, so that heat dissipation can be achieved. function, and make the inner layer plate form a whole after the first pressing, because the inner layer buried hole is blocked by resin ink, which is equivalent to the existence of no inner layer buried hole, in the subsequent pressing process, it can avoid inner layer The surface of the printed circuit board at the buried hole in the inner layer is depressed, or the inner layer board bursts due to gas expansion in the buried hole in the inner layer. [0003] like figure 1 As shown, ...

AI Technical Summary

Problems solved by technology

[0010] The object of the present invention is to provide a resin plug hole manufacturing method to prevent ink from overflowing, aiming to solve the phenomenon of open circuit, short circuit and poor contact in the inner layer pattern caused by the overflow of ink in the resin plug hole manufacturing method in the prior art. Deformation of the board surface of the laminate, uneven thickness of the electroplated copper layer on the inner board and high cost

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