Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
一种环氧树脂、萘酚化合物的技术，应用在印刷电路、印刷电路制造、电路基板材料等方向，能够解决耐热性变化大、耐热性变化、印刷布线基板连接不良等问题，达到耐热性变化少、热膨胀性优异的效果
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Embodiment 1
[0204] Drop into 216 mass parts (1.5 moles) of beta-naphthol, 250 mass parts of Virahol, 122 mass parts of 37% formalin aqueous solution in the flask that thermometer, dropping funnel, condenser tube, fractionating tube, stirrer are installed (1.50 mol), and 31 parts by mass (0.38 mol) of 49% sodium hydroxide were stirred while raising the temperature from room temperature to 75° C., and stirred at 75° C. for 1 hour. Next, 81 parts by mass (0.75 mol) of o-cresol was injected|thrown-in, and it stirred at 75 degreeC for 8 hours further. After the reaction was finished, add 45 parts by mass of sodium dihydrogen phosphate to neutralize, then add 630 parts by mass of methyl isobutyl ketone, wash 158 parts by mass of water repeatedly for 3 times, then dry under heated and reduced pressure to obtain cresol- 290 parts by mass of naphthol resin (a-1). The GPC figure of the cresol-naphthol resin (a-1) obtained is shown in figure 1 . The hydroxyl equivalent of the cresol-naphthol res...
Embodiment 2
[0209] Change to 107 mass parts (1.32 moles) of 37% formalin aqueous solution, o-cresol 61 mass parts (0.56 moles), except that, in the same way as in Example 1, obtain epoxy resin (A-2) 188 mass parts share. The GPC figure of the epoxy resin (A-2) that obtains is shown in Figure 5 . The epoxy equivalent of the epoxy resin (A-2) was 232 g / equivalent, the softening point was 76° C., and the molecular weight distribution (Mw / Mn) was 1.32. The content rate of the component corresponding to the aforementioned dimer (x2) calculated from the GPC chart was 27.4%, and the content rate of the component corresponding to the aforementioned trifunctional compound (x3) represented by the above structural formula (b) was 35.4%, equivalent to The content rate of the component in the said 4 functional group compound (x4) was 14.6 %, and these were 77.4 % in total. In addition, among the aforementioned dimer (x2), the aforementioned trifunctional compound (x3), the aforementioned tetrafunc...
Embodiment 3
[0211] Change to 152 mass parts (1.87 moles) of 37% formalin aqueous solution, o-cresol 122 mass parts (1.13 moles), except that, in the same manner as in Example 1, obtain epoxy resin (A-3) 190 mass parts share. The GPC figure of the epoxy resin (A-3) that obtains is shown in Figure 6 . The epoxy equivalent of the epoxy resin (A-3) was 226 g / equivalent, the softening point was 87° C., and the molecular weight distribution (Mw / Mn) was 1.24. The content rate of the component corresponding to the aforementioned dimer (x2) calculated from the GPC chart was 6.0%, and the content rate of the component corresponding to the aforementioned trifunctional compound (x3) represented by the above structural formula (b) was 27.9%, equivalent to The content rate of the component in the said 4 functional group compound (x4) was 31.7 %, these were 65.6 % in total. In addition, among the aforementioned dimer (x2), the aforementioned trifunctional compound (x3), the aforementioned tetrafunct...
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Abstract
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