Epoxy resin, curable resin composition, cured product thereof, and printed circuit board
An epoxy resin and compound technology, applied in printed circuits, circuit substrate materials, printed circuit components, etc., can solve the problems of poor connection of printed circuit substrates and large changes in heat resistance, and achieve excellent thermal expansion and heat resistance. less variable effect
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Embodiment 1
[0191] Drop into 216 mass parts (1.5 moles) of β-naphthol, 250 mass parts of isopropanol, 122 mass parts of 37% formalin aqueous solution in the beaker that thermometer, dropping funnel, condenser tube, fractionating tube, stirrer are installed (1.50 mol), and 31 parts by mass (0.38 mol) of 49% sodium hydroxide were heated from room temperature to 75° C. while stirring, and stirred at 75° C. for 1 hour. Next, 81 parts by mass (0.75 mol) of p-cresol was injected|thrown-in, and it stirred at 75 degreeC for 8 hours further. After the reaction was completed, after adding 45 parts by mass of sodium dihydrogen phosphate for neutralization, 630 parts by mass of methyl isobutyl ketone was added, and after repeated washing 3 times with water of 158 parts by mass, it was dried under heating and reduced pressure to obtain formazan 290 parts by mass of phenol-naphthol resin (a-1). The GPC spectrogram of gained cresol-naphthol resin (a-1) is shown in figure 1 . The hydroxyl equivalent ...
Embodiment 2
[0196] Except changing to 110 mass parts (1.35 moles) of 37% formalin aqueous solution, 65 mass parts (0.60 moles) of p-cresol, operate in the same manner as in Example 1 to obtain 191 mass parts of epoxy resin (A-2) . The GPC spectrogram of gained epoxy resin (A-2) is shown in Figure 5. The epoxy equivalent of the epoxy resin (A-2) was 240 g / equivalent, the softening point was 93° C., and the molecular weight distribution (Mw / Mn) was 1.24. In addition, the content of the trifunctional compound represented by the structural formula (b) calculated from the GPC spectrum was 56.4%, and the content of the dimer (y) represented by the aforementioned structural formula (2) was 13.5%.
Embodiment 3、4 and comparative example 1
[0201] TD-2090 (phenol novolac resin, hydroxyl equivalent: 105 g / eq) manufactured by DIC Corporation as a curing agent, (A-1) or (A'-1) and 2-ethyl-4-methylimidazole (2E4MZ) as a curing accelerator were prepared by blending methyl ethyl ketone so that the non-volatile content (N.V.) of each composition would eventually be 58% by mass. Next, it was cured under the following conditions to produce a laminate, and the coefficient of thermal expansion and changes in physical properties were evaluated by the following methods. The results are shown in Table 1.
[0202]
[0203] Substrate: Glass cloth "#2116" (210×280mm) manufactured by Nitto Bosho Co., Ltd.
[0204] Number of layers: 6 Prepreg conditions: 160°C
[0205] Curing conditions: at 200°C, 40kg / cm 2 After 1.5 hours, the plate thickness after forming: 0.8mm
[0206]
[0207] Using a viscoelasticity measuring device (DMA: Solid Viscoelasticity Measuring Device "RSAII" manufactured by RHEOMETRIC Co., Ltd., rectangular ...
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