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audio communication system

An audio communication and audio source technology, applied in telephone communication, stereo communication earphones, interconnection devices, etc., can solve problems such as ground bounce, ground noise, wireless electromagnetic noise and side tone feedback

Inactive Publication Date: 2017-12-05
BOSE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the electrical architecture of the system is not properly laid out, the system may suffer from problems such as ground noise (eg, ground bounce), radio electromagnetic noise, and sidetone feedback

Method used

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Examples

Experimental program
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Embodiment Construction

[0016] Problems can arise when attempting to interface a single microphone (boom mic for headsets) with multiple communication devices (eg, radio, intercom). When trying to connect a single electret microphone to multiple communication devices, for example, the equivalent load resistance for this microphone drops (parallel connection of multiple loads), resulting in loss of output signal (loss of sensitivity). Furthermore, they will cause problems if different types of microphones are connected to each other (eg a dynamic microphone cannot be connected to an electret microphone input and vice versa).

[0017] What is disclosed and claimed herein is intended to be applicable to a wide variety of communication headsets, i.e. devices that are structured to be worn on or around the user's head in such a way that at least one acoustic driver is positioned near the ear, and in which the microphone is Positioned toward the user's mouth to enable two-way audio communication. It shoul...

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Abstract

An audio communication system includes a headset having a microphone with two electrical outputs and a first electro-acoustic driver. The system includes first and second differential amplifiers and a first electrical conductor for electrically connecting an output of the first differential amplifier to a first audio source device. A second electrical conductor is provided for electrically connecting the input of the driver with the first audio source device. A third electrical conductor is provided for electrically connecting the output of the second differential amplifier with a second audio source device. A fourth electrical conductor is provided for electrically connecting the input of the driver with the second audio source device. An electrical output from the microphone is electrically connected to the positive input of each differential amplifier. Another electrical output from the microphone is electrically connected to the negative input of each differential amplifier.

Description

Background technique [0001] The present disclosure relates to an audio communication system with earphones for two-way audio communication. If the electrical architecture of the present system is not properly laid out, the system may suffer from problems such as ground noise (eg, ground bounce), wireless electromagnetic noise, and sidetone feedback. Contents of the invention [0002] In one aspect, an audio communication system includes a headset having a microphone having two electrical outputs and a first electro-acoustic driver. The system also includes a first differential amplifier and a second differential amplifier, and a first electrical conductor for electrically connecting an output of the first differential amplifier to the first audio source device. A second electrical conductor is provided for electrically connecting the input of the driver with the first audio source device. A third electrical conductor is provided for electrically connecting the output of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/10H04R5/033H04M9/00
CPCH04R1/1033H04R5/033H04R2420/03H04R2420/09
Inventor P·G·亚姆科沃伊
Owner BOSE CORP