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A kind of uv/moisture dual curing resin and its synthesis method

A dual-curing and resin technology, applied in the field of light-curing materials, can solve the problems of reduced mechanical properties of the adhesive layer, difficulty in curing the adhesive completely, and low initiation efficiency of the photoinitiator, achieving good curing effect, stable reaction speed and curing Object effects, easily controlled effects

Active Publication Date: 2017-08-04
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, light-curing adhesives also have their own limitations. Translucent materials or component shading parts absorb, block and reflect ultraviolet light. Photoinitiators often have low initiation efficiency, and the adhesive is not easy to cure completely, which greatly reduces the mechanical properties of the adhesive layer.

Method used

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  • A kind of uv/moisture dual curing resin and its synthesis method
  • A kind of uv/moisture dual curing resin and its synthesis method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add HDI trimer (Bayer, desmodur N3300) 80g, hydroxyethyl acrylate 5g, polymerization inhibitor p-hydroxyanisole 0.1g, catalyst dibutyltin dilaurate 0.01g into a three-necked flask with a thermometer, and heat up At 65 degrees, start to drop 3 g of bis(γ-trimethoxysilylpropyl)amine (cas: 82985-35-1), control the temperature at 75 degrees, and react for 2 hours. Use an infrared spectrometer to analyze the NCO group, and when the NCO peak does not change, stop the heating reaction to obtain a UV / moisture dual-curable resin.

Embodiment 2

[0028] Add HDI trimer (Bayer, desmodur N3300) 110g, hydroxypropyl acrylate 12g, polymerization inhibitor p-hydroxyanisole 0.1g, catalyst dibutyltin dilaurate 0.01g into a three-necked flask with a thermometer, and heat up At 65 degrees, start to drop 6 g of bis(γ-trimethoxysilylpropyl)amine (cas: 82985-35-1), control the temperature at 70 degrees, and react for 3 hours. Use an infrared spectrometer to analyze the NCO group, and when the NCO peak does not change, stop the heating reaction to obtain a UV / moisture dual-curable resin.

Embodiment 3

[0030] Add HDI trimer (Bayer, desmodur N3300) 100g, hydroxyethyl acrylate 8g, polymerization inhibitor p-hydroxyanisole 0.1g, catalyst dibutyltin dilaurate 0.01g into a three-necked flask with a thermometer, and heat up At 65 degrees, start to drop 4 g of bis(γ-trimethoxysilylpropyl)amine (cas: 82985-35-1), control the temperature at 73 degrees, and react for 2 hours. Use an infrared spectrometer to analyze the NCO group, and when the NCO peak does not change, stop the heating reaction to obtain a UV / moisture dual-curable resin.

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Abstract

The invention provides a synthesis method of UV / moisture dual-curing resin. The method comprises the following steps: placing HDI tripolymer, hydroxied acrylates, polymerization inhibitor hydroquinone monomethylether and catalyst dibutyltin dilaurate into a three-mouth flask with a thermometer, heating the three-mouth flask to 65 DEG C, dropwise adding bis(gamma-trimethoxysilyl propyl)amine, controlling the temperature at 70 to 75 DEG C, and carrying out the reaction for 2 to 3 hours; analyzing NCO groups by utilizing an infrared spectrograph, and stopping the heating reaction when the NCO value is not changed, thereby obtaining the UV / moisture dual-curing resin. The resin can be optically cured by virtue of UV and also can be cured by virtue of moisture, so that the problem that a shadow part cannot be cured in the optical polymerization process; moreover, compared with the resin adopting isocyanate as a reaction group curing-sealing end, the resin adopting methoxylsilane as the moisture curing reaction group is more stable in reaction speed and cured resin effect, and the further curing effect of the product is better.

Description

technical field [0001] The invention relates to a UV / moisture dual-curable resin and a synthesis method thereof, which are suitable for bonding applications of light-shielding or translucent materials, and belong to the field of light-curable materials. Background technique [0002] Light-curing adhesives have been widely studied due to their outstanding advantages such as fast curing speed, environmental friendliness, low energy consumption, and no solvent volatilization, and they are rapidly promoted in various industries. However, light-curing adhesives also have their own limitations. Translucent materials or component shading parts absorb, block and reflect ultraviolet light. Photoinitiators often have low initiation efficiency, and the adhesive is not easy to cure completely, which greatly reduces the mechanical properties of the adhesive layer. . [0003] In order to solve the disadvantage that the shadow part cannot be cured during the photopolymerization process, r...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/79C08G18/67C08G18/28C08G18/24
CPCC08G18/246C08G18/289C08G18/672C08G18/792
Inventor 潘光君王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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