Synthesis of organic silicon modified phenolic resin

A technology of phenolic resin and silicone, applied in the direction of aldehyde/ketone condensation polymer adhesives, adhesive types, adhesives, etc., can solve the problems of LOCA not curing, not absorbing UV light, and incomplete curing, etc., to achieve Good application value, easy control and low production cost

Inactive Publication Date: 2017-05-24
YANTAI SMITHDE ELECTROMECHANICAL EQUIP MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, some specially designed capacitive touch screens have large FPC lines on the conductive glass. Because the FPC itself does not transmit UV light, the LOCA (liquid optical tra

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0009] Example 1

[0010] Add 80g of silicone-modified phenolic resin, 115g of epoxy-modified rosin ester, 0.1g of polymerization inhibitor p-hydroxyanisole, and 0.01g of catalyst dibutyltin dilaurate into a three-necked flask with a thermometer, and heat up to 65 degrees , Reaction 2h. The NCO group was analyzed by an infrared spectrometer, and when the NCO peak did not change, the heating reaction was stopped to obtain a silicone-modified phenolic resin.

Example Embodiment

[0011] Example 2

[0012] Add 110g of silicone-modified phenolic resin, 120g of epoxy-modified rosin ester, 0.1g of polymerization inhibitor p-hydroxyanisole, and 0.01g of catalyst dibutyltin dilaurate into a three-necked flask with a thermometer, and heat up to 70 degrees , Reaction 3h. The NCO group was analyzed by an infrared spectrometer, and when the NCO peak did not change, the heating reaction was stopped to obtain a silicone-modified phenolic resin.

Example Embodiment

[0013] Example 3

[0014] Add 100g of silicone-modified phenolic resin, 118g of epoxy-modified rosin ester, 0.1g of polymerization inhibitor p-hydroxyanisole, and 0.01g of catalyst dibutyltin dilaurate into a three-necked flask with a thermometer, and heat up to 70 degrees , Reaction 3h. The NCO group was analyzed by an infrared spectrometer, and when the NCO peak did not change, the heating reaction was stopped to obtain a silicone-modified phenolic resin.

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PUM

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Abstract

The invention relates to synthesis of an organic silicon modified phenolic resin. A preparation method comprises following steps: 80 to 110g of an organic silicon modified phenolic resin, 115 to 120g of an epoxy modified rosin ester, 0.1g of polymerization inhibitor 4-methoxyphenol, and 0.01g of catalyst dibutyltin dilaurate are delivered into a three mouth flask provided with a thermometer, an obtained mixture is heated to 65 to 70 DEG C, reaction is carried out for 2 to 3h, an infrared spectrometer is used for analysis of NCO groups, when no change of NCO peak is observed, heating reaction is stopped so as to obtain the organic silicon modified phenolic resin. The synthesis reaction process is simple, and is convenient to control, no special equipment is needed; no solvent is used; and production cost is low.

Description

technical field [0001] The invention relates to the synthesis of an organosilicon-modified phenolic resin, belonging to the field of synthetic chemistry. Background technique [0002] The surface protective layer and conductive layer of capacitive touch screen are mostly made of glass substrate, and its refractive index is about 1.52. Therefore, the refractive index of the bonding material is required to be as equal as possible, which can greatly reduce the refraction loss of light between the interfaces and improve the performance of the panel. The contrast and clarity of the display in brightly lit environments. At the same time, under harsh conditions such as ultraviolet radiation, humidity and heat aging, and thermal shock, optically transparent adhesives need to maintain the stability of important indicators such as high light transmittance and low yellowing. [0003] At present, some specially designed capacitive touch screens have large FPC lines on the conductive gl...

Claims

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Application Information

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IPC IPC(8): C08G8/34C09J161/14
Inventor 王立印
Owner YANTAI SMITHDE ELECTROMECHANICAL EQUIP MFG
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