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Polyimide resin film and substrate for electronic equipment including polyimide resin film

A technology of polyimide resin and electronic equipment, which is applied in the field of substrates for electronic equipment, can solve the problems of unsatisfactory plastic film substrates, and achieve the effect of high transparency

Active Publication Date: 2018-03-16
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Currently, no material for plastic film substrates satisfying the above-mentioned required properties has been found, and research is ongoing

Method used

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  • Polyimide resin film and substrate for electronic equipment including polyimide resin film
  • Polyimide resin film and substrate for electronic equipment including polyimide resin film
  • Polyimide resin film and substrate for electronic equipment including polyimide resin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0194] Using the polyimide resin synthesized in Synthesis Example 1, a 22% by mass coating resin solution was prepared using the solvent DMAc. The coating solution is evenly coated on a glass plate with a doctor blade with a coating thickness of 200 μm, baked at 120° C. for 10 minutes in air, baked at 180° C. for 30 minutes under vacuum, and baked at 250° C. Baking for 60 minutes was performed at 300° C. for 60 minutes to obtain a coating film. Table 1 describes the evaluation results of the coating film.

Embodiment 2

[0196] Using the polyimide resin synthesized in Synthesis Example 2, a coating film was produced in the same manner as in Example 1. Table 1 describes the evaluation results of the coating film.

Embodiment 3

[0198] Using the polyimide resin synthesized in Synthesis Example 2, a 30% by mass coating resin solution was prepared using the solvent DMAc. Apply the coating solution evenly on a glass plate with a doctor blade with a coating thickness of 300 μm, bake at 90° C. for 20 minutes in air, bake at 120° C. for 20 minutes, and bake at 180° C. under vacuum. Baking was performed for 30 minutes, at 220° C. for 60 minutes, and at 250° C. for 60 minutes to obtain a coating film. Table 1 describes the evaluation results of the coating film.

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Abstract

The subject of this invention is providing the polyimide resin film which has heat resistance, a low linear expansion coefficient, and high transparency. The solution is a polyimide resin film containing a polyimide resin containing a structural unit represented by the following formula (1). (In formula (1), A represents at least one of the divalent organic groups selected from the following formula (2) or formula (3), and R1 to R3 independently represent hydrogen atoms and carbon atoms. an alkyl group of 1 to 10 or a haloalkyl group of 1 to 10 carbon atoms, m represents a natural number).

Description

technical field [0001] The present invention relates to a polyimide resin film for electronic equipment materials and a substrate for electronic equipment containing the polyimide resin film. Background technique [0002] In recent years, in the fields of liquid crystal (TFT) and other displays, solar cells, and lighting fixtures, substrates used in these devices have been required to be thinner, lighter, and more flexible. Rigid substrates, plastic film substrates that can be thinned, lightweight, and flexible are attracting attention. [0003] In general, properties such as heat resistance, transparency, and dimensional stability (low linear expansion coefficient, etc.) are required for substrates used in displays, solar cells, or lighting fixtures. [0004] For example, in the field of displays, active matrix driven panels are currently used in high-definition displays. In addition to the matrix-like pixel electrodes, in order to form the active matrix layer containing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/06C08J5/18
CPCC08G73/1078C08J5/18C08J2379/08C08G73/06
Inventor 小出泰之
Owner NISSAN CHEM IND LTD