Unlock instant, AI-driven research and patent intelligence for your innovation.

MEMS (micro-electromechanical system) reliability assessment method

A reliability and evaluation model technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problem of low evaluation efficiency and achieve the effect of improving efficiency

Active Publication Date: 2015-09-16
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Based on this, it is necessary to provide a MEMS reliability evaluation method for the technical problem of low evaluation efficiency in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • MEMS (micro-electromechanical system) reliability assessment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The specific implementation of the MEMS reliability evaluation method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0013] refer to figure 1 , figure 1 Shown is the MEMS reliability assessment method flowchart of an embodiment, comprises the following steps:

[0014] S10, obtaining the failure rate of the cantilever beam, the chip failure rate and the package failure rate of the MEMS;

[0015] In the above step S10, the failure rate of the cantilever beam, the chip failure rate and the package failure rate of the MEMS can be obtained through the local test of the corresponding part of the MEMS.

[0016] S20, measure the components in the MEMS, and obtain the vibration coefficient, temperature coefficient, temperature amplitude coefficient, and cycle rate coefficient of the MEMS;

[0017] In one embodiment, the measurement process of the above temperature coefficient may include:

[0018] Measure ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an MEMS (micro-electromechanical system) reliability assessment method. The method includes the steps of acquiring cantilever failure rate, chip failure rate and packaging failure rate of an MEMS; measuring components of the MEMS, and acquiring vibrational coefficient, temperature coefficient, temperature amplitude coefficient and cycle rate coefficient of the MEMS; plugging the cantilever failure rate, chip failure rate, packaging failure rate, vibrational coefficient, temperature coefficient, temperature amplitude coefficient and cycle rate coefficient into a set assessment module to acquire the reliability of the MEMS. According to the method, the cantilever failure rate, chip failure rate and packaging failure rate of the MEMS are acquired, the components of the MEMS are measured, the vibrational coefficient, temperature coefficient, temperature amplitude coefficient and cycle rate coefficient of the MEMS are acquired, and the reliability of the MEMS is further assessed; thus, assessment on the reliability of the MEMS needs no huge tests, and assessment efficiency is effectively increased.

Description

technical field [0001] The invention relates to the technical field of integrated system evaluation, in particular to a MEMS reliability evaluation method. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) combines electronic, mechanical or other (magnetic, liquid and thermal, etc.) Adjacent to the micro field, it not only has the characteristics of miniaturization, low cost, integration, low power consumption, and excellent performance in the general sense, but also has excellent performance such as high-sensitivity sensing in the special sense. With the continuous breakthrough of the technical level, MEMS products have been widely used in various fields at present. [0003] The incomparable advantages of MEMS products make them play a very important key supporting role in the construction of modern weapons and equipment, especially in the informatization of military equipment and the equipment of information weapons. In...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F19/00
Inventor 任艳
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH