Shooting module and shooting device
A camera module and mounting surface technology, applied in the field of photography, can solve the problems of reduced image resolution, affecting image quality, image blur, etc., to achieve the effects of improving resolution, improving image quality, and improving assembly flatness
Inactive Publication Date: 2015-10-07
NANCHANG OFILM HUAGUANG TECH CO LTD
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Problems solved by technology
[0002] At present, the circuit board of the camera module has corresponding lines and bumps on the surface of the circuit board due to the design requirements of the inner layer circuit, and the surface of the image sensor chip is not smooth enough. The plane where the image sensor chip is located is relatively inclined to the plane of the PCB, which reduces the resolution of the image and blurs the captured image, which affects the image quality
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[0027] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0028] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicati...
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Abstract
The invention discloses a shooting module including a circuit board, a single image sensing chip, and a flattening plate, the image sensing chip is electrically connected with the circuit board, the flattening plate is arranged between the circuit board and the image sensing chip, the circuit board and the image sensing chip are respectively arranged on the two opposite surfaces of the flattening plate, and the flattening plate is used for improving the assembling flatness of the circuit board and the image sensing chip. The invention further discloses a shooting device. Because the flattening plate is arranged between the circuit board and the image sensing chip, the assembling flatness of the circuit board and the image sensing chip is improved, the image resolution is improved, and the imaging quality is improved.
Description
technical field [0001] The present invention relates to the field of camera technology, in particular to a camera module and a camera device. Background technique [0002] At present, the circuit board of the camera module has corresponding lines and bumps on the surface of the circuit board due to the design requirements of the inner layer circuit, and the surface of the image sensor chip is not smooth enough. As a result, after the image sensor chip is pasted on the circuit board, The plane where the image sensor chip is located is relatively inclined to the plane of the PCB, which reduces the resolution of the image, and blurs the captured image, which affects the image quality. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention needs to provide a camera module. [0004] The present invention also needs to provide an imaging device. [0005] The came...
Claims
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Login to View More IPC IPC(8): H04N5/225G03B5/00
Inventor 王昕刘磊于立新
Owner NANCHANG OFILM HUAGUANG TECH CO LTD