Anti-splash and anti-adhesion type process cavity of TRACK machine glue evening unit

A process cavity and anti-adhesion technology, applied in the field of process cavity, can solve the problems of photoresist adhesion and backsplash, and achieve the effect of reducing adhesion, improving performance and reducing the number of particles

Active Publication Date: 2015-10-14
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process chamber solves the problem of backsplash after the glue droplet collides with the process chamber (also known as CUP) during the uniform glue process, and solves the problem of photoresist sticking to the inner wall of the CUP through special surface treatment

Method used

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  • Anti-splash and anti-adhesion type process cavity of TRACK machine glue evening unit
  • Anti-splash and anti-adhesion type process cavity of TRACK machine glue evening unit
  • Anti-splash and anti-adhesion type process cavity of TRACK machine glue evening unit

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Embodiment Construction

[0019] The present invention will be further described below in conjunction with the accompanying drawings.

[0020] Such as Figure 1-3 As shown, the present invention includes an upper process chamber 2, a middle process chamber 3 and a lower process chamber 4, and the upper process chamber 2 and the middle process chamber 3 cooperate with the lower process chamber 4 respectively to form a whole. The upper process chamber inner surface 10 of the upper process chamber 2 is provided with an anti-splash groove 5 and coated with a hydrophilic layer.

[0021] Such as Figure 4 As shown, the anti-backlash tank 5 includes an upper back-splash tank and a lower back-splash tank, and the upper back-splash tank and the lower back-splash tank are along the upper process chamber inner surface 10 The grooves are concave upwards from top to bottom, and the wafer 1 is located between the lower edge 6 of the upper anti-splash groove and the lower edge 8 of the lower anti-splash groove. Th...

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Abstract

The invention relates to a process cavity of a glue evening unit, and specifically relates to an anti-splash and anti-adhesion type process cavity of a TRACK machine glue evening unit. The anti-splash and anti-adhesion type process cavity comprises an upper process cavity, a middle process cavity and a lower process cavity, wherein the upper process cavity and the middle process cavity respectively cooperate with the lower process cavity to form one integral body, the inner-side surface of the upper process cavity is provided with an anti-splash groove and a coating hydrophilic layer, the anti-splash groove comprises an upper-portion anti-splash groove and a lower-portion anti-splash groove which are successively recessed upwards along the inner surface of the upper process cavity from top to bottom, and a wafer is disposed between the lowest edge of the upper-portion anti-splash groove and the lowest edge of the lower-portion anti-splash groove. According to the invention, splashes generated when a photoresist bumps into a CUP can be effectively prevented, through changing the hydrophilic and hydrophobic characteristic of the inner wall of the CUP, the adhesion of the photoresist on the inner wall of the CUP is reduced, and the performance of the glue evening unit can be effectively improved.

Description

technical field [0001] The invention relates to a process cavity of a glue leveling unit, in particular to an anti-splash and anti-adhesion type process cavity of the glue leveling unit of TRACK machine, which is applied to the glue leveling unit in TRACK machine of semiconductor equipment . Background technique [0002] TRACK is one of the core equipments of lithography process in the field of semiconductor manufacturing, and the internal glue leveling unit is its important functional unit. In the glue leveling unit, the process chamber (also called CUP) is the core component, which directly affects the effect of the glue leveling process. During TRACK’s homogenization process, most of the photoresist dropped on the wafer surface will break away from the wafer due to the centrifugal force during the high-speed rotation of the wafer and be thrown into the CUP. After the photoresist is detached from the wafer, it will collide with the inner wall of the CUP. After the collis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 刘莹
Owner SHENYANG KINGSEMI CO LTD
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