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Cooling device assembly capable of cooling for power well in building

A technology for cooling devices and power wells, which is applied to electrical components and other directions, can solve the problems of building electricity safety risks, complex cooling device structures, and difficult cooling devices to dissipate heat, achieve compact structure, avoid unstable factors, and reduce local overheating areas. Effect

Inactive Publication Date: 2015-12-09
SHISHI CHUANLANG MACHINERY DESIGN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This uneven heat build-up has a damaging effect on the insulation on the cable surface and poses a potential risk to the electrical safety of the entire building
[0004] It is difficult for the existing cooling device to dissipate heat at the heat concentration point, or the structure of the cooling device is too complicated

Method used

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  • Cooling device assembly capable of cooling for power well in building
  • Cooling device assembly capable of cooling for power well in building

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Experimental program
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Embodiment Construction

[0011] Combine below Figure 1-2 The present invention will be described in detail.

[0012] According to an embodiment, a heat-dissipating cooling device assembly for a power well in a building includes a plurality of cooling devices that are separately arranged along the vertical direction of the power well and are supplied with gas by a gas delivery pipe 61, and each cooling device includes The cooling device body 82 and the fixing brackets 100 arranged on both sides of the cooling device body 82 for fixing on the two opposite side walls 102 of the power well, the fixing brackets 100 are provided with a power supply cable 1030 Through the cable fixing hole 103, the cooling device body 82 includes an annular cavity housing 15 provided with a gas inlet nozzle 6 to communicate with the gas delivery pipe 61, and the annular cavity housing 15 is integrated The bottom surface annular portion 152 and the upper side cylindrical portion 151 are provided with a gas communication cav...

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PUM

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Abstract

A cooling device assembly capable of cooling for a power well in a building comprises a plurality of cooling devices, wherein the cooling devices are separately arranged along a vertical direction of the power well, a gas is supplied to the cooling devices through a gas transmission pipe (61), each cooling device comprises a cooling device body (82) and fixed supports (100), the fixed supports (100) are arranged at the two sides of the cooling device body (82) and used for being fixed at two opposite side walls (102) of the power well, cable fixing holes (103) are formed in the fixed supports (100) and used for a power supply cable (1030) to pass through, the cooling device body (82) comprises an annular cavity shell (15), and the annular cavity shell (15) is provided with a gas inlet nozzle (6) communicated with the gas transmission pipe (61).

Description

technical field [0001] The present application relates to the construction field, in particular to a cooling device assembly capable of dissipating heat for a power well in a building. Background technique [0002] In the building, in order to uniformly supply power to the electrical equipment on each floor, a power well is often provided to allow power cables to pass between floors. In order to discharge the heat generated by the cables in the power well in time and ensure the safety of electricity use, the power well is usually provided with a common exhaust pipe to discharge the heat uniformly. [0003] During the long-term use of power cables, the power consumption of each floor is different, and the different structures that the cables pass through and the different changes in the quality of the cables will cause concentrated heat accumulation in the cable bundle. This uneven heat accumulation has a damaging effect on the insulation layer on the surface of the cable an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02G3/03
Inventor 宏大
Owner SHISHI CHUANLANG MACHINERY DESIGN CO LTD
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