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Heat welding test bed and test method of diode

A technology of diode and thermal welding, which is applied in the direction of measuring heat, testing a single semiconductor device, and using a thermometer directly sensitive to heat/magnetic elements, etc. It can solve problems such as weak welding, electrical changes, and diode breakdown. Achieve good economic benefits

Active Publication Date: 2015-12-16
JINAN JINGHENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the temperature is too high or the pressure is too long, the chip of the diode will be easily affected by the high temperature, resulting in electrical changes. In severe cases, the diode will break down, resulting in the failure of the anti-backflow device and damage to the solar panel. cause serious consequences
If the temperature is too low or the pressure time is too short, the welding will not be firm enough to cause quality problems

Method used

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  • Heat welding test bed and test method of diode
  • Heat welding test bed and test method of diode

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Embodiment Construction

[0021] The present invention will be further described and defined below in conjunction with the accompanying drawings and specific embodiments.

[0022] Such as figure 1 , 2 As shown, a diode thermal welding test bench includes a heating part, a pressing part and a control part. The heating part includes a heating table 1 and a heating tube 2 located inside the heating table 1. The heating table 1 is provided with a lower fixture groove 3. The pressing part includes an upper fixture groove 4 and a moving mechanism that drives the upper fixture groove 4 to move. Both the upper fixture groove 4 and the lower fixture groove 3 are U-shaped grooves, and the upper fixture groove 4 is located at the bottom of the lower fixture groove 3. Directly above, the upper fixture groove 4 approaches or moves away from the lower fixture groove 3 under the drive of the moving mechanism. When approaching the lower fixture groove 3, the U-shaped openings of the upper and lower fixture grooves ar...

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PUM

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Abstract

The invention discloses a heat welding test bed and test method of a diode. According to the heat welding test bed of the diode, a temperature control part and a pressure acting time control part are additionally adopted, so that the temperature and pressure acting time in diode heat welding can be controlled, and therefore, the diode can be welded under different temperature and pressure acting time, and the electrical performance of the diode can be tested, and as a result, temperature and pressure acting time which are most suitable for diode welding can be obtained. With the heat welding test bed and test method of the invention adopted, the temperature and pressure acting time suitable for diode heat welding can be obtained, and a series of problems caused by diode failure which is further caused by the inaccuracy of welding temperature and pressure can be solved, and great economic benefits can be created.

Description

technical field [0001] The invention relates to a diode heat welding test and a diode heat welding test method based on the test bench, belonging to the technical field of diode welding. Background technique [0002] In a solar panel, in order to achieve a stable and continuous power supply, the solar energy must first be collected in the battery, and then power the electrical appliances. In the process of converting solar energy into electrical energy through the battery panel and then charging the energy storage battery, there must be a device to prevent the reverse flow of the energy storage battery. This device is very important. Its importance lies in preventing the reverse flow of the stored electric energy in the battery. solar panel. Based on this purpose, using the single-phase conductivity of the diode, solder wires with insulating layers at both ends of the diode, one end of the wire is connected to the output end of the solar panel, and the other end is connecte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/04G01R31/26
Inventor 张禹城马根林李亚南张明张斌田龙
Owner JINAN JINGHENG ELECTRONICS