Coppering solution special for vertical and continuous electroplating of PCB
A solution and copper plating technology, applied in the field of special copper plating solution for PCB vertical continuous electroplating, can solve the requirement of high aspect ratio board through-hole and blind hole high filling, poor copper plating layer plating ability, reduced Production efficiency and other issues, to achieve the effect of good gloss, smooth copper layer and long service life
Inactive Publication Date: 2016-05-11
SHENZHEN XINHONGSHUN TECH CO LTD
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Problems solved by technology
As the core part of electronic products, PCB is a very complicated process from design to production to integration, and electroplating copper is the most important link in the PCB production process, and it is also the surface treatment process that circuit board manufacturers must choose. Market share Huge; circuit boards are developing towards high-density interconnection (HDI), and the aperture ratio is getting higher and higher, which requires copper plating to have better through-hole performance. In the pa
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[0021] For ease of understanding, the present invention will be further described below in conjunction with specific embodiments, but it is not intended to limit the protection scope of the present invention.
[0022] Table 1 is the formula component of each embodiment of the present invention
[0023] The formula component of each embodiment of table 1
[0024]
[0025] The formulation of the present invention is applied to polychlorinated N-vinyl-N'-propanesulfonic acid imidazole-N-butyl acrylate (QVIS-BA ) is a cationic surfactant that can be adsorbed on the copper surface of the cathode, and the adsorption is high in the high-current area, thereby hindering the deposition of copper ions in the bath in the high-current area and achieving the leveling effect. The inhibitory carrier polyethylene glycol (PEG) 8000 and the accelerator sodium polydisulfide dipropane sulfonate (SPS) through the strong jet flow method, the difference in adsorption concentration on the surface ...
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The invention provides a coppering solution special for vertical and continuous electroplating of a PCB. The coppering solution comprises 480-240 g/L of H2SO, 60-250 g/L of CuSO4.5H2O, 50-80 ppm of chloride ions, 1.6-2.0 ppm of leveling agents, 100-200 ppm of inhibitor, 80-180 ppm of wetting agents, 10 ppm of accelerator and the balance water. According to the coppering solution provided by the invention, holes of different depth-diameter ratios can be perfectly electroplated, and the uniform electroplating capacity and the dispersing capacity are very good; in addition, the solution is stable in performance and long in service life; the copper plating layer is flat, good in malleability and gloss and high in toughness.
Description
technical field [0001] The invention belongs to the technical field of electroless copper plating, in particular to a special copper plating solution for vertical continuous electroplating of PCBs. technical background [0002] With the rapid development of electronic information industry, it drives the rapid expansion of circuit board industry. As the core part of electronic products, PCB is a very complicated process from design to production to integration, and electroplating copper is the most important link in the PCB production process, and it is also the surface treatment process that circuit board manufacturers must choose. Market share Huge; circuit boards are developing towards high-density interconnection (HDI), and the aperture ratio is getting higher and higher, which requires copper plating to have better through-hole performance. In the past, we have reduced the current density and adopted pulse plating to meet high through-hole performance. High hole-filling...
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CPCC25D3/38
Inventor 曾高明
Owner SHENZHEN XINHONGSHUN TECH CO LTD