Multi-temperature zone semiconductor refrigeration equipment and its temperature control method

Abstract

The invention discloses multi-temperature-zone semiconductor refrigerating equipment and a temperature control method thereof. Supply voltages Ui are respectively acquired according to the requirement of refrigerating capacity of an ith compartment, the maximum value in the supply voltages Ui is determined, a power supply is controlled to output the maximum value so as to supply power for a semiconductor refrigerating module, therefore, the requirement of the refrigerating capacity of each compartment can be set according to demands of users, the temperature of each temperature zone can be adjusted optically, required optical temperature difference can be realized between each two compartments, different demands of the users can be met, and a plurality of temperature zones can be realized indeed. When temperature difference is greater than or equal to a preset temperature threshold value, the supply voltage is equal to a maximum refrigerating capacity voltage, so that the temperature can be rapidly reduced by relatively high refrigerating efficiency when the temperature difference is relatively large, and then the temperature difference rapidly tends to a relatively small value; and when the temperature difference is reduced to be the temperature difference threshold value, the supply voltage begins to be reduced from the maximum refrigerating capacity voltage, therefore, over fast cooling can be avoided, and the circumstance that the temperature is reduced to be a value which is far lower than a preset value and then the refrigerating effect is poor is avoided.

Description

technical field [0001] The invention belongs to the technical field of semiconductor refrigeration equipment, in particular to a semiconductor refrigeration equipment with multiple temperature zones and a temperature control method thereof. Background technique [0002] The semiconductor refrigeration equipment in the prior art releases cold energy through the cold end of the semiconductor refrigeration module to cool the storage space in the box. However, in the actual use process, it is all through the natural cooling in the box. Due to the effect of the gravity field, the temperature in the lower part of the box is low and the temperature in the upper part is high. Shelves can be placed in the box to form a temperature zone with small temperature differences. However, because the temperature of the lower part is low and the temperature of the upper part is high, the lower part can only store items with higher storage temperature requirements, and the upper part can only s...

AI Technical Summary

Problems solved by technology

However, because the temperature of the lower part is low and the temperature of the upper part is high, the lower part can only store items with higher storage temperature requirements, and the upper part can only store items with lower storage temperature requirements. The position of the temperature zone is fixed and cannot be changed. Moreover, the temperature of the temperature zone The difference is limited, unable to meet the different storage needs of different users

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