Light emitting diode packaging structure and bearing part thereof

Abstract

The invention discloses a light emitting diode packaging structure and a bearing part thereof. The light emitting diode packaging structure comprises the bearing part, a light emitting diode chip and at least one lead. The bearing part comprises a lead frame and an insulating adhesive, the lead frame comprises a chip seat and at least one electrode, and the chip seat and the at least one electrode form electrical insulation through a gap. Each electrode is provided with at least one concave structure, and an insulating material at the bottom of the insulating adhesive partially coats the lead frame and fills the gap and each concave structure. The insulating material in each concave structure can lengthen a path through which external moisture permeates into the bearing part, so that surface oxidation of the chip seat and each electrode can be reduced.

Description

[0001] This application is a divisional application of an invention patent application with an application date of May 30, 2012, an application number of "201210173756.7", and an invention title of "light-emitting diode packaging structure and its carrier". technical field [0002] The invention relates to a light-emitting diode packaging structure and its carrier, in particular to a light-emitting diode packaging structure and its carrier that can reduce the surface oxidation of a lead frame. Background technique [0003] Light emitting diode (light emitting diode, LED) is a solid-state light-emitting component made of semiconductor materials. Most of them are composed of group III chemical elements and group V chemical elements. Form release; due to the different energy levels occupied by electrons and holes in the two poles of different materials, the gap between the two energy levels is called the energy gap (gap), which affects the energy of the combined photon and emits...

AI Technical Summary

Problems solved by technology

However, when the LED packaging structure is exposed to oxygen or moisture, the moisture will infiltrate upwards from the outer edge of the structure of the lead frame or from the lower surface along the bonding interface between it and the packaging adhesive, causing the packaging structure to be damaged. The surface of the exposed lead frame at the bottom of the internal accommodation space is oxidized, especially the notch (ear) formed by the insulating colloid accommodation space corresponding to the electrode wiring part of the lead frame is most susceptible to moisture intrusion, causing Oxidation and blackening of the electrode wiring part will occur. This kind of oxidation and blackening surface will absorb reflected light, which will reduce the brightness of the light-emitting diode emitted from the accommodation space, cause uneven light color or affect the wiring reliability of the wire. This further increases the operational instability of the LED packaging structure, resulting in lower product yields

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