Light-emitting diode package structure and its carrier

Abstract

The invention discloses a light-emitting diode packaging structure and a bearing piece thereof. The light-emitting diode packaging structure comprises the bearing piece, a light-emitting diode chip and at least one lead wire. The bearing piece comprises a lead frame and an insulation colloid member, the lead frame is provided with a chip bearing seat and at least one electrode, and the chip bearing seat and the electrode form electrical insulation through a gap; the electrode is provided with at least one recessed structure, insulation materials at the bottom of the insulation colloid member coat parts of the lead frame and are filled into the gap and the recessed structure, and by means of the insulation materials in the recessed structure, the path for external steam to permeate into the bearing piece can be lengthened, so that the phenomena of surface oxidations of the chip bearing seat and the electrode are reduced.

Description

technical field [0001] The invention relates to a light-emitting diode packaging structure and its carrier, in particular to a light-emitting diode packaging structure and its carrier that can reduce the surface oxidation of a lead frame. Background technique [0002] Light emitting diode (light emitting diode, LED) is a solid-state light-emitting component made of semiconductor materials. Most of them are composed of group III chemical elements and group V chemical elements. Form release; due to the different energy levels occupied by electrons and holes in the two poles of different materials, the gap between the two energy levels is called the energy gap (gap), which affects the energy of the combined photon and emits light of different wavelengths, including Visible light and invisible light. [0003] The biggest features of light-emitting diodes are: green environmental protection, low power consumption, high luminous efficiency, long service life, low maintenance cost...

AI Technical Summary

Problems solved by technology

However, when the LED packaging structure is exposed to oxygen or moisture, the moisture will infiltrate upwards from the outer edge of the structure of the lead frame or from the lower surface along the bonding interface between the lead frame and the packaging material, resulting in a breakdown of the packaging structure. The surface of the exposed lead frame at the bottom of the internal accommodation space is oxidized, especially the notch (ear) formed by the insulating colloidal accommodation space corresponding to the electrode wiring part of the lead frame is most susceptible to moisture intrusion, so that Oxidation and blackening of the electrode wiring part will occur. This kind of oxidation and blackening surface will absorb reflected light, which will reduce the brightness of the light emitting diode emitted from the accommodation space, cause uneven light color or affect the wiring reliability of the wire. This further increases the operational instability of the LED packaging structure, resulting in lower product yields

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