Assembling method of heat pipe heat dissipation type heat exchange device

Abstract

The invention provides an assembling method of a heat pipe radiation type heat exchange device. The heat exchange device comprises a heat conductor and a plurality of heat pipes. A plurality of insertion holes are formed in the heat conductor. The heat pipes are inserted in the insertion holes in a sealed mode. A first through hole is formed in the portion between every two adjacent insertion holes. A second through hole is formed in the end, inserted in the corresponding insertion hole, of each heat pipe. The first through holes communicate with the second through holes to form a channel. A filling port is formed in one end opening of the channel, and a safe pressure valve is arranged at the other end opening of the channel. The assembling method comprises the steps that the end of each heat pipe is inserted into the corresponding insertion hole, so that the first though holes are made to communicate with the second through holes to form the channel, then the heat pipes are welded into the insertion holes in the sealed mode, and finally the filling port and the safe pressure valve are connected to the end openings of the channel. When the pressure of the heat pipes is excessively high, the safe pressure valve is opened automatically for pressure relief, and thus the safety performance is improved. The multiple heat pipes are uniformly connected to the heat conductor so that assembling steps of the heat exchange device and the cold end of a semiconductor refrigerating module can be effectively simplified, and thus the assembling cost is reduced.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a method for assembling a heat pipe radiation heat exchange device. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art is connected to the heat pipe through the cold end of the semiconductor refrigeration module, so as to release cold energy through the heat pipe to cool the storage space in the box. However, in ac...

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Problems solved by technology

However, in actual use, multiple heat pipes are usually connected together and directly attached to the cold end of the semiconductor refrigeration module. When the semiconductor refrigeration module breaks down, the pressure in the heat pipes will easily rise, causing the heat pipes to burst. The safety of semiconductor refrigeration equipment in technology is low

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