Heat exchange device and semiconductor refrigeration equipment

Abstract

The invention provides a heat exchange device and semiconductor refrigerating equipment. The heat exchange device comprises a heat conductor and two heat pipes. A plurality of insertion holes are formed in the heat conductor. The heat pipes are inserted into the insertion holes in a sealed mode. A first through hole is formed between every two adjacent insertion holes. A second through hole is formed in the end, inserted into the corresponding insertion hole, of each heat pipe. The first through holes communicate with the second through holes to form a channel. A filling port is formed in one end opening of the channel, and a safe pressure valve is arranged at the other end opening of the channel. Cold of the cold end of a semiconductor refrigerating module is transferred to the heat pipes through the heat conductor, the cold can be distributed on the whole heat pipes rapidly through the heat pipes, the bulk temperature of the heat pipes is uniform, and therefore the cold can be rapidly transferred into a storage space defined by liners through the heat pipes, so that the effect that the cold of the internal storage space is distributed uniformly is guaranteed, and the refrigerating capacity of the semiconductor refrigerating equipment is improved.

Description

technical field [0001] The invention relates to a refrigeration device, in particular to a heat exchange device and semiconductor refrigeration equipment. Background technique [0002] At present, refrigeration equipment (such as refrigerators, freezers, and wine cabinets) is an electrical appliance commonly used in people's daily life. Refrigeration equipment usually has a refrigeration system. Generally, the refrigeration system is composed of a compressor, a condenser, and an evaporator, which can achieve a lower temperature. of refrigeration. However, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is also widely used. The semiconductor refrigeration equipment in the prior art releases cold energy through the cold end of the semiconductor refrigeration module to cool the storage space in the box. However, in actual use, the cold end of the semiconductor refrigeration modul...

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Problems solved by technology

However, in actual use, the cold end of the semiconductor refrigeration module usually adopts heat sinks for forced convection to dissipate the cold energy into the storage space, and the cooling energy can be transported to the storage space of the refrigeration equipment by means of a fan. , low cooling efficiency

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