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Workpiece processing system and method

A processing system and workpiece technology, which is applied in the field of bending workpiece systems, can solve the problems of poor manual bending accuracy, excessive bending angle, and low production efficiency.

Active Publication Date: 2018-02-16
TYCO ELECTRONICS (SHANGHAI) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The workload of manual bending is heavy, the burden on the workers is heavy, and the production efficiency is very low
In addition, the accuracy of manual bending is poor, and various problems may occur, for example, the bending angle is too large or too small, the bending edge deviates from the theoretical bending edge, and the contact surface of the pin of the electronic device and the bending mold is prone to scratches. Injury etc.

Method used

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  • Workpiece processing system and method
  • Workpiece processing system and method
  • Workpiece processing system and method

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Embodiment Construction

[0043] The technical solutions of the present invention will be further specifically described below through the embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals designate the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, but should not be construed as a limitation of the present invention.

[0044] According to a general technical idea of ​​the present invention, a workpiece processing system is provided, including: a bending mechanism, used for bending a workpiece at a predetermined angle along a predetermined bending line. Wherein, the bending mechanism includes: a frame; clamps, installed on the frame, for clamping the workpiece along the bending line; lifting mechanisms, installed on the frame, capable of Move up and down in ...

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Abstract

The invention discloses a workpiece processing system, which includes: a bending mechanism, which is used to bend the workpiece at a predetermined angle along a predetermined bending line. The bending mechanism includes: a frame; a fixture installed on the frame for clamping the workpiece along the bending line; a lifting mechanism installed on the frame and capable of move up and down; a gear, pivotally mounted on the lifting mechanism; a rack, mounted on the lifting mechanism and meshed with the gear, for driving the gear to rotate around its central axis; a rack driving mechanism , installed on the lifting mechanism, used to drive the rack to move up and down along the vertical direction; and bending rollers, fixed on the end face of the gear, so as to go around the central axis together with the gear rotate. In the present invention, an automatic bending mechanism is used to bend the workpiece, so the bending work of the workpiece can be completed efficiently and with high precision.

Description

technical field [0001] The present invention relates to a system and method for machining workpieces, and more particularly to a system and method for bending workpieces. Background technique [0002] In the electronics industry, the pins of many electronic devices are bent instead of straight. Therefore, during the manufacturing process, it is necessary to bend the pins of these electronic devices and ensure that the surface of the pins of the electronic devices The plating cannot be scratched. In the prior art, the pins of these electronic devices are generally bent manually. The workload of manual bending is very large, the burden on the workers is heavy, and the production efficiency is very low. In addition, the accuracy of manual bending is poor, and various problems may occur, for example, the bending angle is too large or too small, the bending edge deviates from the theoretical bending edge, and the contact surface of the pin of the electronic device and the bendi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21F1/00B21F11/00B21C51/00
Inventor 胡绿海张丹丹鲁异罗伯特·N·夏多克周磊
Owner TYCO ELECTRONICS (SHANGHAI) CO LTD