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proximity sensor cap

A technology of proximity sensors and sensors, applied in the direction of instruments, using optical devices to transmit sensing components, measuring instrument components, etc., can solve the problems of increasing manufacturing costs, forming holes, and cap parts that cannot be properly adhered

Active Publication Date: 2019-09-03
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If cap components 102a to 102c and / or adhesive materials 120a to 120c are not placed precisely in their intended locations, cap components 102a to 120c may not adhere properly and / or may not adhere properly to light emitting device 108 and sensor area 114. hole 104 and hole 106 are respectively formed on the
Therefore, the fabrication of the proximity sensor 100 can result in a high defect rate, which can increase manufacturing costs

Method used

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Examples

Experimental program
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Embodiment Construction

[0017] Figure 2A to Figure 2H Proximity sensor cap assembly 200 is shown at various stages of fabrication according to one embodiment.

[0018] Such as Figure 2A As shown, a carrier 202 is provided. An adhesive layer 204 is formed over the upper surface of the carrier 202 . For example, carrier 202 may be a silicon or glass substrate or a metal plate, and adhesion layer 204 is formed from a conventional adhesive material.

[0019] Such as Figure 2B As shown, a plurality of conventional lenses 206 are placed over the adhesive layer 204 . For example, lens 206 may be placed over adhesive layer 204 using a pick and place mechanism utilizing conventional surface mount techniques. For example, lens 206 may be formed from glass or plastic. The lens 206 may allow most, if not all, of the light incident on the lens 206 to pass through the lens 206 . For example, lens 206 may allow light in the visible spectrum (e.g., light having a wavelength from about 400 nm to about 700 n...

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PUM

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Abstract

The invention relates to a method of forming a proximity sensor cap. The method includes the following steps that: lenses are arranged on an adhesion layer, wherein each lens includes a first side facing the adhesion layer and a second side which faces a direction opposite to the adhesive layer; an encapsulation layer is formed, wherein the encapsulation layer is provided with a firs side which contacts with the adhesion layer and a second side which contacts with the second sides of each of the lenses, the encapsulation layer and lenses are is separated from the adhesive layer, and are turned and arranged on the other adhesive layer, the encapsulation layer containing the lenses is arranged so that the first sides of each of the lenses can face a direction opposite to the other adhesive layer; and cap pins are formed on the encapsulation layer, wherein each cap pin contacts with the second side of the encapsulation layer and extends from the second side of the encapsulation layer; and the encapsulation layer is separated from the other adhesive layer.

Description

technical field [0001] The present application relates generally to semiconductor devices, and more particularly to semiconductor proximity sensor devices. Background technique [0002] Figure 1A is a top plan view of a conventional proximity sensor 100 . Proximity sensor 100 includes a cap 102 having a first aperture 104 and a second aperture 106 formed therein. FIG. 1B is a proximity sensor 100 along Figure 1A A cross-sectional view of line 1B-1B is shown. The proximity sensor 100 includes a light emitting device 108 and a semiconductor die 110 arranged on a printed circuit board substrate 112 . The upper surface of the semiconductor die 110 includes a sensor region 114 . [0003] Such as Figure 1B As shown, the cap 102 includes a first cap component 102a, a second cap component 102b, and a third cap component 102c. The cap parts 102a to 102c are extremely small, typically having dimensions between 15 microns and 150 microns. Cap 102 also includes a pair of lenses...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01D5/26G01D11/00
Inventor 栾竟恩J·泰赛尔
Owner STMICROELECTRONICS SRL