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Light-emitting device

一种发光装置、发光叠层的技术，应用在半导体器件、电气元件、电路等方向，能够解决发光效率降低等问题

Active Publication Date: 2016-12-21
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the n-type electrode a2 needs enough area to facilitate subsequent manufacturing processes, such as wire bonding, most of the active layer 1106 is removed, resulting in reduced luminous efficiency

Method used

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Embodiment Construction

[0079] Embodiments of the present invention will be described in detail and drawn in the accompanying drawings, and the same or similar parts will appear with the same numbers in the drawings and descriptions.

[0080] Figure 1A-Figure 1F A light emitting device 1 according to the first embodiment of the present invention is shown. like Figure 1E As shown, the light-emitting device 1 includes an LED with a support substrate 18; a bonding layer 16; a first contact layer 14; a light-emitting stack 12; a first conductive layer 11; a second conductive layer 13; A reflective layer 15 ; a protection layer 19 ; a first conductive post 20 ; a first electrode 22 and a second electrode 24 . like Figure 1AAs shown, a method for manufacturing a light emitting device 1 includes providing a growth substrate 10; sequentially forming a first semiconductor layer 122, an active layer 124 and a second semiconductor layer 126 on the growth substrate 10 to form a light emitting stack 12 ; a...

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Abstract

A light-emitting device includes a first electrode; a light-emitting stacked layer on the first electrode; a first contact layer on the light-emitting stacked layer, wherein the first contact layer includes a first contact link and a plurality of first contact lines connected to the first contact link; a first conductive post in the light-emitting stacked layer and electrically connecting the first electrode and the first contact layer; and a passivation layer between the first conductive post and the light-emitting stacked layer.

Description

[0001] This invention is a divisional application of a Chinese invention patent application (application number: 201210110378.8, application date: April 13, 2012, invention name: light emitting device). technical field [0002] The invention relates to a light emitting device, in particular to a light emitting device with conductive columns. Background technique [0003] Light-emitting diodes (Light-emitting Diodes; LEDs) have been widely used in optical display devices, traffic signs, data storage devices, communication devices, lighting devices and medical equipment. like Figure 11 As shown, the LED has an n-type semiconductor layer 1104, an active layer 1106 and a p-type semiconductor layer 1108 sequentially formed on a substrate 1102, and part of the p-type semiconductor layer 1108 and the active layer 1106 are removed to expose part of the n-type semiconductor layer 1108. The p-type semiconductor layer 1104, a p-type electrode a1 and an n-type electrode a2 are respecti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38
CPCH01L33/38H01L33/385H01L33/382H01L33/405H01L33/44H01L2924/0002H01L33/0093H01L2924/00H01L33/08H01L33/10H01L33/62
Inventor 陈怡名谢明勋许嘉良
Owner EPISTAR CORP